Industry News: testing failures (Page 1 of 62)

Repair Services Being Outsourced by OEMs and EMS Firms

Industry News | 2003-03-06 08:43:16.0

Under pressure to fulfill growing repair obligations in the United States, some OEMs and EMS companies are outsourcing projects to product-lifecycle managers.

SMTnet

New Service has PCB Cleaning Down to a Fine Art

Industry News | 2003-06-26 09:02:38.0

The surface quality of printed circuit boards and components directly impacts performance and product life.

SMTnet

Upgraded CAM Software Eliminates More Bugs

Industry News | 2003-03-12 08:28:44.0

CAM350 Release 8 is aimed at allowing engineering and manufacturing groups to detect and fix potential PCB fabrication problems earlier in the process.

SMTnet

Legacy Electronics Receives U.S. Patent for 3-D Memory Module with Canopy-type Carriers

Industry News | 2003-05-30 08:26:20.0

The inventors of this module type and holders of the patent are chief technical officer Kenneth J. Kledzik and president Jason C. Engle, both of San Clemente, California.

SMTnet

SMTA Capital Chapter to Host Second Meeting of the Year on May 28th at NTS Baltimore on “Failure Analysis Process for Printed Board Assemblies” by John M. Radman

Industry News | 2015-05-18 21:29:50.0

The SMTA Capital Chapter is pleased to announce its second meeting of 2015 on May 28th, scheduled from 5:30 pm to 8:00 pm at NTS Baltimore formerly Trace Labs, 5 North Park Drive, Hunt Valley, MD 21030. The focus of this chapter meeting will be “Failure Analysis Process for Printed Board Assemblies” presented by John M. Radman, Senior Applications Engineer, NTS Baltimore.

Surface Mount Technology Association (SMTA)

AIMS Harsh Environments Symposium To Address Lead-Free Solders, Materials, Failure Mechanisms and Screening

Industry News | 2012-07-24 11:04:04.0

The SMTA announced that the AIMS Harsh Environments Symposium will be held on October 15, 2012 as a focused symposium at SMTA International in Orlando, FL.

Surface Mount Technology Association (SMTA)

How Much Strain Can a Package Take?

Industry News | 2011-12-14 15:35:33.0

Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.

Association Connecting Electronics Industries (IPC)

Cleaning and Contamination Testing Center at IPC APEX EXPO Offers Free Mini Seminars

Industry News | 2013-01-17 11:15:42.0

One of the “cleanest” areas on the IPC APEX EXPO® show floor will be found at the IPC/NPL Cleaning and Contamination Testing Center

Association Connecting Electronics Industries (IPC)

IPC & SMTA to Kick Off High-Reliability Cleaning & Conformal Coating Conference with a Keynote from Google

Industry News | 2016-09-08 13:12:42.0

Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place October 25-27, 2016 at Hyatt Rosemont, Rosemont, IL. The conference is focused on best practices for designing, cleaning and coating highly dense electronic assemblies to assure reliability in today’s mobile society.

Association Connecting Electronics Industries (IPC)

LED A.R.T. Symposium Program Announced

Industry News | 2017-09-18 14:36:13.0

CALCE and SMTA are pleased to announce the program for the LED Assembly, Reliability & Testing Symposium held at the Archie K. Davis Conference Center in Research Triangle Park, NC from November 28 - November 30, 2017.

Surface Mount Technology Association (SMTA)

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