Industry News: thermal cycle (Page 7 of 38)

High Thermal Impact Reliability Water-Soluble Solder Paste from SHENMAO Wins 2023 NPI Award

Industry News | 2023-01-30 16:07:57.0

SHENMAO America, Inc. received a 2023 NPI Award in the category of Soldering Materials for its PF918-PW216 water-soluble high thermal impact reliability solder paste. The award was announced during a ceremony that took place Monday, Jan. 23, 2023 in San Diego.

Shenmao Technology Inc.

SMT 158 -- A Underfill Solution for Miniaturization in Microelectronics

Industry News | 2015-05-13 13:57:18.0

The current trend of miniaturization in microelectronics have paved the way for 3D packaging; allowing for lower manufacturing cost, increased memory and speed and a greater variation in functional uses of the miniaturized devices.

YINCAE Advanced Materials, LLC.

Nihon Superior Introduces Lead-Free Solder Paste for Automotive Requirements

Industry News | 2022-11-15 12:50:53.0

Nihon Superior Co. Ltd. is pleased to introduce its LF-C2 Lead-Free Solder Paste. Designed for automotive applications, LF-C2 is the high-strength alloy of choice when cracking minimization is a key selection criterion.

Nihon Superior Co., Ltd.

Reflow Oven Video Released for Surface Mount Printed Circuit Board Assembly from APS Novastar

Industry News | 2010-09-24 11:43:04.0

Reflow Oven video providing overview of APS Novastar's Reflow Oven products for lead-free and lead based reflow soldering, curing, and thermal cycling applications.

DDM Novastar Inc

Indium Corporation Wins Global Technology Award

Industry News | 2013-11-14 18:14:55.0

Indium Corporation was presented with the Global Technology Award for its SACM™ Solder Alloy at Productronica in Münich, Germany on November 12.

Indium Corporation

Indium Corporation Announces New Solder Paste Technology

Industry News | 2014-01-31 00:23:23.0

Indium Corporation announces a new solder paste technology. BiAgX™ is a high-melting lead-free (Pb-free) solder paste technology designed for high reliability electronics assembly applications. Designed as a drop-in replacement for standard high Pb-containing solder pastes, it has passed MSL1 and thermal cycle testing at several power semiconductor customers.

Indium Corporation

PDR’s New IR Thermal Test System Thermally Cycles Key Critical Components to Detect Defects

Industry News | 2017-08-16 11:15:46.0

PDR today announced plans to exhibit at SMTA International. The PDR team will showcase the Evolution Series Rework Systems – including the new PDR IR-E3M Micro Component/PCB Rework System – in Booth #233. Additionally, the new PDR IR-TS One IR Thermal Test System will be available for demos.

PDR-America

Learn about PDR’s Rapid Dual Thermal Defect Detection & Component / Solder-Joint Validation at SMTA Wisconsin

Industry News | 2017-04-23 11:18:17.0

PDR, a leader in IR rework, test and inspection, is pleased to announce that Horizon Sales will discuss its new PDR IR-TS Series of micro-focused HALT/HASS thermal test systems at the SMTA Wisconsin Expo & Tech Forum, scheduled to take place Tuesday, May 2, 2017 at the Milwaukee Airport Crowne Plaza in WI. Horizon Sales is PDR’s exclusive representative in the Midwestern U.S.

PDR-America

An Innovation Reliability Solution to Interconnect of Flexible/Rigid Substrates

Industry News | 2014-07-28 15:50:58.0

Miniaturization is a trend in the electronic industry, which has increasingly attracted more attention. However, the manufacturing process and reliability have become more and more challenging due to miniaturization. The main issues that miniaturization present are the strength of solder joints, decreasing thermal cycling performance, and product reworkability.

YINCAE Advanced Materials, LLC.

An Innovation Reliability Solution to Interconnect of Flexible/Rigid Substrates

Industry News | 2018-04-09 10:49:39.0

(Albany, NY)– Miniaturization is a trend in the electronic industry, which has increasingly attracted more attention. However, the manufacturing process and reliability have become more and more challenging due to miniaturization. The main issues that miniaturization present are the strength of solder joints, decreasing thermal cycling performance, and product reworkability.

YINCAE Advanced Materials, LLC.


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