Industry News: thermal inverter (Page 1 of 2)

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

New Yorker Electronics releases Long-Life DC Link Capacitors from Cornell Dubilier Electronics

Industry News | 2021-08-02 14:05:26.0

New Yorker Electronics supplies Cornell Dubilier CDE BLH Series DC Link Capacitors for Long Life, High Power Density and Low ESR Designed for Harsh Environments

New Yorker Electronics

Vincotech’s One-Step Mounting Technology – Fast, Reliable, Flexible

Industry News | 2012-06-29 08:09:26.0

Aiming to cut assembly costs and avert inverter assembly flaws, several companies now offer power modules that can be mounted in a single step. Some use housings with a hole in the middle and a lid to hold the PCB, module and heat sink in place.

Vincotech

Seica SpA at productronica, Munich, November 12 – 15th, 2013, Hall A1, Booth A1-445, New Munich Trade fair

Industry News | 2013-10-08 15:50:04.0

“Welcome to the new dimension of test, the fourth dimension”.

SEICA SpA

Henkel Develops Thermally Conductive Technomelt® Solution

Industry News | 2016-03-30 09:04:09.0

Adding functional capability to its award-winning Technomelt® hot melt encapsulants, Henkel Adhesive Technologies today announced another formulation milestone with the development of a thermally conductive Technomelt material. With the ability to transfer heat through the encapsulating layer, thermally conductive Technomelt products offer dual-function performance in a single material solution.

Henkel Electronic Materials

Broad Portfolio of Henkel Enabling Technologies on Show at SMTA International 2016

Industry News | 2016-09-21 15:44:21.0

From booth #936 at the upcoming SMTA International event in Rosemont, Illinois, Henkel Adhesive Electronics’ display will underscore why the company leads the market in comprehensive assembly materials technologies. With multi-award-winning LOCTITE GC solder materials, a broad range of leading-edge thermal management technologies, and new applications for TECHNOMELT products, the Henkel booth is the go-to destination for advanced electronics assembly materials.

Henkel Electronic Materials

Seica SpA to exhibit new systems, new features at productronica 2013

Industry News | 2013-10-08 13:10:27.0

"Welcome to the new dimension of test, the fourth dimension". As usual, Seica is back to the exhibition with a full range of ATE machines for every need, and a lot of innovative solutions for test and selective soldering, but this time the news are really raising the bar of technology over the top. The “new dimension” of test will be showcased through several different lines of products, all designed around the common core of the enhanced VIP platform, where 3.0 generation is ready to go for the future of test, taking care of TIME, the fourth dimension of our living space and the most important key factor of every industrial process.

SEICA SpA

MacDermid Alpha to Introduce Sintering Products at the Step-by-Step Technical Conference in Hangzhou China

Industry News | 2020-10-31 10:43:47.0

The Assembly Division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will be presenting an"Introduction to Sintering Products" at the Step-by-Step Technical Conference on Thursday, November 5th, 2020 in Hangzhou, China.

MacDermid Alpha Electronics Solutions

Indium Corporation Experts to Present at PCIM e-Mobility Forum

Industry News | 2022-04-28 14:36:21.0

Indium Corporation experts will share their technical insight and knowledge on automotive and electric vehicle (EV) materials solutions as part of an e-Mobility forum at PCIM Europe, May 10-12, Nuremberg, Germany.

Indium Corporation

Heraeus Electronics to Present "Al2O3, ZTA, AMB and What's Next?" at PCIM Europe

Industry News | 2022-05-18 12:37:13.0

Heraeus Electronics today announced that Bastian Schlüter, Global Product Manager Metal Ceramic Substrates, will present during the E-Mobility Forum at PCIM Europe. The presentation entitled, "Al2O3, ZTA, AMB and What's Next?" is scheduled to take place May 11, 2022 at 12:50 p.m.

Heraeus

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