Industry News: thermal printing (Page 1 of 80)

Legacy Electronics Receives U.S. Patent for 3-D Memory Module with Canopy-type Carriers

Industry News | 2003-05-30 08:26:20.0

The inventors of this module type and holders of the patent are chief technical officer Kenneth J. Kledzik and president Jason C. Engle, both of San Clemente, California.

SMTnet

Altium CAM System and Free ODB++ Viewer Bridge Gap Between PCB Design and Manufacture

Industry News | 2003-03-11 08:45:00.0

CAMtastic DXP is the latest version of Altium's complete CAM verification and editing system that bridges the gap between PCB design and manufacturing and facilitates communication between board designers, fabrication engineers, and their clients.

SMTnet

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

Upgraded CAM Software Eliminates More Bugs

Industry News | 2003-03-12 08:28:44.0

CAM350 Release 8 is aimed at allowing engineering and manufacturing groups to detect and fix potential PCB fabrication problems earlier in the process.

SMTnet

Tin Whisker Joint Meeting Held in Tokyo

Industry News | 2003-06-23 08:49:39.0

Three Organizations from the US, Europe and Japan to

SMTnet

Nordson Electronics Solutions introduces new Helios® system for dispensing single-component thermal interface materials

Industry News | 2022-05-05 17:28:46.0

Includes new, easy-to-operate pail pump with unique pail change and loading method, which also reduces material waste

Nordson Electronics Solutions

IPC Thermal Management Conference Highlights What’s Cool in Today’s Technologies and Materials

Industry News | 2010-09-22 15:01:40.0

Removing heat has become a major issue in the electronics industry as more highly integrated devices are jammed into less space and as high power devices, such as LEDs, become increasingly more common.

Association Connecting Electronics Industries (IPC)

Updates in IPC-6018B Help Engineers Design High-reliability Boards Specification addresses growing field of microwave technology

Industry News | 2012-05-04 09:21:15.0

As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.

Association Connecting Electronics Industries (IPC)

SMTA International Conference on Soldering and Reliability Call for Papers

Industry News | 2011-01-07 10:56:12.0

The SMTA Technical Committee cordially invites industry professionals to submit abstracts for the 2011 International Conference on Soldering and Reliability being held this May 4-6, 2011 in Toronto, Ontario, Canada. Abstracts are due by January 28, 2011.

Surface Mount Technology Association (SMTA)

IPC Delivers the First Automotive Standard on Performance Requirements for Rigid Printed Boards

Industry News | 2016-06-27 14:54:49.0

In September of 2015, IPC delivered revision D of IPC-6012, Qualification and Performance Specification for Rigid Printed Boards. Building on this base standard, IPC has developed the first automotive addendum, IPC-6012DA, Automotive Applications Addendum to IPC-6012D Qualification and Performance Specification for Rigid Printed Boards.

Association Connecting Electronics Industries (IPC)

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