Industry News: thermal profile (Page 1 of 75)

Heller Industries Announces Joint Development Agreement with IBM for Fluxless Mass Reflow Soldering Process for High Volume Manufacturing

Industry News | 2013-08-15 20:58:22.0

Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.

Heller Industries Inc.

Heller Industries Becomes the Latest Partner to Join THE SMT FUTURE EXPERIENCE

Industry News | 2025-12-15 11:02:26.0

Heller Industries becomes the latest partner to join THE SMT FUTURE EXPERIENCE, bringing reflow oven expertise to complete the technology chain for the venue's live SMT production line. With Heller now alongside founding partners Fuji America, Koh Young, and Creative Electron, the San Marcos, California venue can demonstrate fully integrated manufacturing processes from screen printing and placement through thermal processing to final inspection and verification.

Heller Industries Inc.

Advances in Heated Dispense Process

Industry News | 2016-06-27 14:59:09.0

GPD Global introduces the NEW TempView Thermal Imaging System that ensures the success of heated dispensing processes like Underfill, Encapsulations, Dam and Fill, and more. The TempView Thermal Imaging System monitors the temperature of the entire substrate for complete heat profile characterization. Regions of the product may be selected for monitoring during the heating process. Now you can accurately monitor temperature of specific devices to be sure they are up to temperature before starting a process.

GPD Global

International Rectifier Introduces Bi-Directional Dual MOSFET in the FlipFET Package

Industry News | 2003-01-29 13:23:31.0

A Common Drain Configuration that is 80% Smaller than Devices in the TSSOP-8 Package

SMTnet

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

Reflow oven zone temperature set up and thermal profile

Industry News | 2018-10-18 08:42:00.0

Reflow oven zone temperature set up and thermal profile

Flason Electronic Co.,limited

How to get real-time thermal data for a PCB?

Industry News | 2018-10-18 10:20:21.0

How to get real-time thermal data for a PCB?

Flason Electronic Co.,limited

BGA Component Rework

Industry News | 2001-08-02 18:32:09.0

BGA Rework Profiling

Precision PCB Services, Inc

Capital Chapter & Connecticut Chapter Joint Technical Webinar

Industry News | 2024-11-18 19:12:46.0

The SMTA Capital Chapter is co-hosting a free webinar for SMTA members with the SMTA Connecticut Chapter on Tuesday, November 19th at 11am EST.

Surface Mount Technology Association (SMTA)

How to optimize the reflow profile?

Industry News | 2018-10-18 08:37:41.0

How to optimize the reflow profile?

Flason Electronic Co.,limited

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