Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2016-06-27 14:59:09.0
GPD Global introduces the NEW TempView Thermal Imaging System that ensures the success of heated dispensing processes like Underfill, Encapsulations, Dam and Fill, and more. The TempView Thermal Imaging System monitors the temperature of the entire substrate for complete heat profile characterization. Regions of the product may be selected for monitoring during the heating process. Now you can accurately monitor temperature of specific devices to be sure they are up to temperature before starting a process.
Industry News | 2003-01-29 13:23:31.0
A Common Drain Configuration that is 80% Smaller than Devices in the TSSOP-8 Package
Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Industry News | 2018-10-18 10:20:21.0
How to get real-time thermal data for a PCB?
Industry News | 2018-10-18 08:42:00.0
Reflow oven zone temperature set up and thermal profile
Industry News | 2024-11-18 19:12:46.0
The SMTA Capital Chapter is co-hosting a free webinar for SMTA members with the SMTA Connecticut Chapter on Tuesday, November 19th at 11am EST.
Industry News | 2018-10-18 08:37:41.0
How to optimize the reflow profile?
Industry News | 2001-03-20 05:34:19.0
Precision PCB Services announced today that they are now providing BGA Component Rework Training. This course is designed for students that require hands-on skill and knowledge to reliably remove and install many types of the most complex BGA components.
