Industry News: thermal stress testing (Page 1 of 93)

GPD Global Live Demos at IPC APEX in Las Vegas Convention Center

Industry News | 2016-02-27 22:07:08.0

GPD Global will exhibit in Booth#1818 at the upcoming IPC APEX EXPO 2016 Conference and Exhibition. See a live demonstration of 01005 dispensing on the MAX series high precision dispenser, the intuitively programmed Island series benchtop dispenser, and a full range of dispense pumps used on GPD dispense systems.

GPD Global

GPD Global's PCD Technology Is Proven Compatible with Silver-filled Electrical and Thermal Epoxies

Industry News | 2010-12-07 14:53:07.0

GPD Global announces that its Positive Cavity Displacement (PCD) technology is proven with silver-filled electrically and thermally conductive adhesives.

GPD Global

Tin Whisker Joint Meeting Held in Tokyo

Industry News | 2003-06-23 08:49:39.0

Three Organizations from the US, Europe and Japan to

SMTnet

Legacy Electronics Receives U.S. Patent for 3-D Memory Module with Canopy-type Carriers

Industry News | 2003-05-30 08:26:20.0

The inventors of this module type and holders of the patent are chief technical officer Kenneth J. Kledzik and president Jason C. Engle, both of San Clemente, California.

SMTnet

Upgraded CAM Software Eliminates More Bugs

Industry News | 2003-03-12 08:28:44.0

CAM350 Release 8 is aimed at allowing engineering and manufacturing groups to detect and fix potential PCB fabrication problems earlier in the process.

SMTnet

2002 NEMI Roadmap Points to Areas of Opportunity for Industry

Industry News | 2003-04-07 10:16:38.0

Portable Products and Optoelectronic Applications Still Hold Promise for Growth

SMTnet

How to get real-time thermal data for a PCB?

Industry News | 2018-10-18 10:20:21.0

How to get real-time thermal data for a PCB?

Flason Electronic Co.,limited

Call for Participation — Deadline Extended to 2/21/20!

Industry News | 2020-02-18 14:31:52.0

Join us for High Reliability Forum as a presenter or instructor and share your expertise in electronics with high reliability requirements.

Association Connecting Electronics Industries (IPC)

IPC Issues Call for Papers for Third Annual IPC High Reliability Forum

Industry News | 2018-08-29 19:35:22.0

IPC — Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC High Reliability Forum to be held May 14–16, 2019 in Hanover (Baltimore), Md.

Association Connecting Electronics Industries (IPC)

IPC Issues Electronics Industry Warning on Printed Board Microvia Reliability for High Performance Products

Industry News | 2019-03-10 20:30:11.0

The proliferation of tighter microvia densities and signal integrity requirements in printed boards within the electronics industry has revealed reliability concerns with microvia structures in high performance products. A number of IPC OEM member companies have approached IPC with examples of microvia failures in high-profile hardware that were not observed until after bare printed board fabrication, inspection and acceptance, including:

Association Connecting Electronics Industries (IPC)

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