Industry News | 2018-10-18 09:27:40.0
Time Temperature setting wave soldering is the most important in the solder melts
Industry News | 2015-03-02 21:09:35.0
IPC – Association Connecting Electronics Industries® presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO® at the San Diego Convention Center. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.
Industry News | 2010-04-10 02:09:54.0
If a picture is worth a thousand words, the new H revision of IPC-A-600, Acceptability of Printed Boards, is a priceless work of art for fabricators and assemblers, particularly inspectors and product developers. IPC — Association Connecting Electronics Industries® announces the new releases of IPC-A-600H and its companion document the C revision of IPC-6012, Qualification and Performance Specification for Rigid Printed Boards.
Industry News | 2018-10-18 09:37:27.0
How To Set Profile In SMT Reflow Oven
Industry News | 2018-10-18 08:59:34.0
PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)
Industry News | 2010-03-03 14:29:02.0
OK International (www.okinternational.com) has launched a new soldering system for PV tabbing and bussing applications proven to reduce micro cracking. The PS900 with specially designed hoof tip geometry optimizes the power delivered to the solder joint while it’s temperature-sensitive heater ensures low temperature soldering thus minimizing thermally induced stresses on cell surfaces.
Industry News | 2014-10-14 11:36:35.0
AI Technology, Inc (AIT) Develops Conformal Coatings to Protect Electronics in Extreme Environments. AI Technology (AIT) is proud to present its improved Prima Protect™ coating line for moisture and salt fog protection.
Industry News | 2017-08-30 16:58:11.0
Akrometrix will be a panelist in the upcoming SMTAI Spotlight 5 panel discussion, scheduled to take place Wednesday, Sept. 10, 2017 from 2-3 p.m. The discussion, entitled “Warpage Induced Defects and Component Warpage Limits,” will be streamed on Facebook Live.
Industry News | 2010-09-16 21:44:04.0
The Balver Zinn Group announces that Cobar Europe BV now distributes Yincae Advanced Materials’ SMT 158 Capillary Underfill and SMT 256 Individual Solder Joint Encapsulations throughout Europe.
Industry News | 2013-02-08 23:26:44.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1751-4, that is extraordinarily crack resistant, to withstand flexing experienced by flexible printed circuitry or drops and shocks of very thin printed circuit assemblies.
