Industry News | 2010-02-22 11:53:39.0
Rehm Thermal Systems has moved into a new Applications Center which will serve their North America marketplace. Located in the Atlanta suburb of Roswell, the new facility is designed to provide Rehm customers everything needed to characterize their convection and condensation reflow processes.
Industry News | 2018-05-14 10:30:22.0
The world's first commercial diamond filled underfill.
Industry News | 2011-12-30 23:35:59.0
Nihon Superior will issue a new series of guides on “Key Factors in the Selection of Lead-Free Solders.” This series is intended to address the challenges in choosing a reliable lead-free solder. The first guide in the series is titled “Reliability of Lead-Free Solder in Thermal Cycling.”
Industry News | 2011-03-17 16:52:47.0
Rehm Thermal Systems is preparing to showcase its advanced thermal technologies at this year’s Apex exhibition, being held in Las Vegas from 12th – 14th April. As the only single source for convection and condensation soldering systems, Rehm will be demonstrating its unique capabilities from Booth 635.
Industry News | 2018-05-18 15:47:55.0
As chips and packages become more complex, and installed in harsher conditions such as automobiles, the thermal conductivity of underfill materials becomes a greater concern. What can be done to prevent decreased reliability due to thermal dissipation issues?
Industry News | 2009-10-26 14:48:05.0
A new thermal oxidation process from Rehm Thermal Systems has eliminated the challenge of residue contamination from photovoltaic metallization. In order to minimise maintenance and provide a cleaner process chamber, Rehm has innovatively implemented a proven method of thermal oxidation to enhance the performance of its RDS Drying Systems.
Industry News | 2012-01-13 13:20:53.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1736, designed to underfill 0.4-mm pitch Package-on-Package (POP) assemblies. It has low viscosity and a lower CTE than its predecessors. Plus it has greater flux compatibility, making it suitable for use with a broader range of solderpastes and tacky fluxes.
Industry News | 2016-05-13 11:56:03.0
The process of manufacturing and qualifying IC's consists of many steps while Temperature forcing systems play a crucial role in the final testing process. These environmental tests assure quality and reliability by stressing the device on one hand as well as helping to characterize and validate it on the other hand (making sure manufacturing outcome meets the design requirements). At later stages the temperature testing can support failure analysis effort and root cause analysis. AS common practice we are dealing with few different kinds of temperature forcing systems: Chambers, Thermal Stream systems and Direct Thermal Head systems. In this article I would like to focus on the practical aspects of utilizing Thermal Stream systems and Direct Thermal Head systems.
Industry News | 2016-05-13 12:00:12.0
The process of manufacturing and qualifying IC's consists of many steps while Temperature forcing systems play a crucial role in the final testing process. These environmental tests assure quality and reliability by stressing the device on one hand as well as helping to characterize and validate it on the other hand (making sure manufacturing outcome meets the design requirements). At later stages the temperature testing can support failure analysis effort and root cause analysis. AS common practice we are dealing with few different kinds of temperature forcing systems: Chambers, Thermal Stream systems and Direct Thermal Head systems. In this article I would like to focus on the practical aspects of utilizing Thermal Stream systems and Direct Thermal Head systems.
Industry News | 2013-07-22 17:01:59.0
Isola Group S.a.r.l. announced today its new low loss, low skew, high-speed material, GigaSync™. This product has been engineered to eliminate skew issues in high-speed designs that use differential pairs to create a balanced transmission system able to carry differential (equal and opposite) signals across a printed circuit board.
