Industry News | 2022-03-30 14:59:52.0
YINCAE is excited to announce that we have developed DA158N die attach materials which is thermal conductive and electrical insulating adhesives. It can be fast cured at low temperature. The development of DA 158N is preparing the materials for people to live in the Mars.
Industry News | 2010-12-07 15:07:35.0
Christopher Associates announced today the introduction of Koki’s SB6N58-A730 Low Temperature Lead-Free Solder Paste. SB6N58-A730 paste has a melting point of 201-210°C. The paste also demonstrates extremely high thermal shock durability.
Industry News | 2011-06-16 15:01:31.0
Kyzen announces that Dr. Mike Bixenman will host an upcoming IPC Webinar titled “Cleaning Highly Dense Circuit Assemblies and Advanced Packages” on Tuesday, July 19, 2011 from 10-11 a.m. CST.
Industry News | 2011-07-26 21:41:43.0
Kyzen announces that Dr. Mike Bixenman hosted an informative IPC Webinar titled “Cleaning Highly Dense Circuit Assemblies and Advanced Packages” on Tuesday, July 19, 2011.
Industry News | 2012-08-10 07:00:10.0
Engineered Conductive Materials introduces its new fast curing Conductive Adhesive CA-100 for stringing and bussing next-generation CIGS solar modules.
Industry News | 2012-12-04 15:55:26.0
Engineered Conductive Materialsintroduces the fast curing CA-141 Conductive Adhesive for stringing and bussing next-generation CIGS solar modules.
Industry News | 2024-01-29 11:33:44.0
Indium Corporation® is proud to showcase its proven advanced assembly materials for power electronics, including the rapidly evolving electric vehicle (EV) manufacturing and e-Mobility market, at NEPCON Japan, January 24-26, in Tokyo, Japan. Indium Corporation's products for power electronics have been demonstrated to reduce energy consumption and solve warpage issues for its customers while ensuring high reliability and improving overall efficiency.
Industry News | 2014-06-10 11:59:03.0
(Albany, NY) June 10, 2014. YINCAE Advanced Materials, LLC is pleased to announce the availability of a series of new encapsulant products that enable greater production temperature flexibility for microchips with different alloy applications.
Industry News | 2014-11-18 18:10:25.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN) have adopted the company’s hot pin pull test method for checking the integrity of solder ball attach on packages and PCBs in accordance with the industry standard IPC9708. This particular standard provides guidelines for bond testing to identify potential pad craters.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
