Industry News | 2010-02-12 09:55:13.0
San Diego — February 2010 — KIC, the leader of thermal process development and control products, and winner of multiple industry awards, announces that Brian O’Leary, its Americas Sales Manager, will present “How to profile complex PCBs: creating offsets, balancing your board and nondestructive profiling strategies” at 10:30 a.m. at the upcoming SMTA Houston Expo and Tech Forum, scheduled to take place Thursday, March 4, 2010 at the Stafford Centre in Stafford, TX.
Industry News | 2010-06-16 11:06:03.0
San Diego, CA — KIC, the leader of thermal process development and control products, and winner of multiple industry awards, announces that Brian O’Leary, Sales Manager – Americas, will host a Webinar as part of the IPC ― Association Connecting Electronics Industries®’ Summer School Series. The series is expected to reach a global audience of more than 40,000 contacts.
Industry News | 2011-01-25 14:49:29.0
New Reflow Oven Introduced by APS Novastar - The ERO-500 Reflow Soldering System, A Five Zone, Cost-Effective Reflow Solution for Small to Medium Volume Lead-Free SMT Production and Prototyping.
Industry News | 2011-07-28 18:27:19.0
Advanced Thermal Solutions, Inc, (ATS), continues its innovations in electronics thermal management with the BWT-104 Bench Top Wind Tunnel. The BWT-104 is a research quality, open loop wind tunnel for thermally characterizing components, circuit boards and cooling devices such as heat sinks, heat exchangers and cold plates.
Industry News | 2012-01-19 23:34:38.0
KIC will debut the Reflow Process Index (RPI) in Booth #2428 at the upcoming IPC APEX Expo.
Industry News | 2012-03-07 00:46:11.0
KIC has been awarded a 2012 NPI Award in the category of Soldering - Wave for its new KIC 24/7 Wave. The new KIC 24/7 Wave utilizes embedded sensors in the wave solder machine to automatically measure the thermal profile for each and every processed PCB to the acceptable process window.
Industry News | 2013-02-07 11:10:53.0
RO-CONTROL and RO-SOFT from Essemtec are state-of-the-art software packages for simulation, control and documentation reflow and curing ovens and processes. Operators, process engineers and quality managers profit from the advanced functionality of the new version 7.
Industry News | 2013-11-22 17:35:58.0
Process Technology introduces its new Frontier™ Series electropolished stainless steel inline fluid heater for high purity solvent heating applications.
Industry News | 2014-08-16 17:55:06.0
Toddco General, Inc. released the new TG-1000 bonding platform to easily support large display panels or other substrates requiring hot bar bonding of flexible circuits, TABs, COF or COG. Designed for process development labs, high-mix production or repair environments.
Industry News | 2015-03-16 18:27:21.0
KIC today announced that it will exhibit in Stand B-1D40 at NEPCON China 2015, scheduled to take place April 21-23, 2015 at the Shanghai World EXPO Exhibition & Convention Center. Company representatives will demonstrate the Footprint, ProBot, X5, K2 and Mobile Profile Viewer APP.
