Industry News | 2003-05-19 10:06:43.0
The PCB is available with a maximum panel size of 406-by-460mm and a minimum board thickness of 0.8mm.
Industry News | 2003-06-04 08:27:58.0
DuPont cites rising raw material, transportation and energy costs as reasons for the increase.
Industry News | 2003-03-24 09:46:41.0
Will feature a number of new technologies of interest to fabricators in printed circuit materials, laminate materials, polymer thick films and, most notably, its newest product line of embedded passive materials, DuPont Interra�.
Industry News | 2003-06-16 08:33:59.0
This action is part of the DuPont strategy to build on its leadership position in circuit materials, by expanding and strengthening the level of service and support available to its customers.
Industry News | 2003-06-24 08:14:51.0
R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.
Industry News | 2011-05-06 22:30:34.0
Nordson ASYMTEK introduces its new film coater for automated, selective, and precision application of conformal coating materials. The Nordson ASYMTEK Select Coat® SC-280 provides greater than 99 percent fluid transfer efficiency, improving material utilization by 30 to 50 percent.
Industry News | 2018-05-30 17:35:13.0
Nordson ASYMTEK a Nordson company (NASDAQ: NDSN), a leader in dispensing, coating, and jetting technologies, received two prestigious awards for innovative technology for its Select Coat® SC-350 Select Spray applicator for conformal coating applications. The Innovation Award, from Electronics Manufacturing (EM) Asia, and VISION Award, from SMT China magazine, were presented at NEPCON China, held in the Shanghai EXPO World Center, Shanghai, China, on April 24 and 25, 2018.
Industry News | 2003-04-22 09:19:21.0
Ciena Corporation�s winning paper received $1,000 and a commemorative plaque from IPC.
Industry News | 2003-05-27 08:13:23.0
The Ninth Annual Pan Pacific Microelectronics Symposium
Industry News | 2010-05-30 23:23:13.0
Minneapolis, MN - The Surface Mount Technology Association (SMTA) announces the Call for Papers for the 2011 Pan Pacific Microelectronics Symposium, which will be held January 18-20, 2011 on the Big Island of Hawaii. The symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems technology and assembly. The deadline for abstracts is July 16, 2010.
