Industry News | 2014-01-14 13:56:05.0
Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will present Properties and Applications of Low-Temperature Solders as part of a webinar sponsored by the SMTA on January 28 from 1-3 p.m.
Industry News | 2014-01-29 11:09:40.0
Indium Corporation announces that Glen Thomas has been named Product Manager for PCB Assembly Solder Paste.
Industry News | 2014-04-08 12:02:53.0
Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will present at the International Workshop on WGB Power Electronics April 10-11 in Hsinchu, Taiwan. Dr. Lee will present The Status and Prospect of Silver Sintering Paste Development. This presentation will discuss the significance of silver sintering paste for high power semiconductor devices and its future potential .
Industry News | 2015-09-24 17:01:32.0
Indium Corporation's Eric Bastow, Assistant Technical Manager, will present at a meeting of the Puget Sound Chapter of the SMTA on Oct. 27 in Seattle, Wash.
Industry News | 2016-03-22 16:57:05.0
Indium Corporation's new Indium10.8HF is a halogen-free, no-clean solder paste that is formulated to provide industry-leading non-wet open performance on large, high IO electronic packages, such as microprocessors.
Industry News | 2016-03-23 20:19:20.0
Indium Corporation's new Indium10.8HF is a halogen-free, no-clean solder paste that is formulated to provide industry-leading non-wet open performance on large, high IO electronic packages, such as microprocessors.
Industry News | 2018-11-07 14:41:49.0
Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, will lead a professional development course during the 20th Electronics Packaging Technology Conference, Dec. 4-7 in Sentosa, Singapore.
Industry News | 2014-08-06 12:31:51.0
Indium Corporation announces that Andy C. Mackie, Ph.D., MSc, has been named president of the Empire Chapter of the International Microelectronics Assembly and Packaging Society (IMAPS).
Industry News | 2014-09-23 11:18:59.0
Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will present a technical paper at the 9th International Microsystems, Packaging, Assembly, Circuits Technology Conference (IMPACT), Oct. 22-24 in Taipei, Taiwan. Dr. Lee will present Voiding and Reliability of BGA Assemblies Produced with SAC and BiSnAg Solder Alloys.
Industry News | 2014-10-08 21:22:35.0
Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will share his expertise at the 11th Annual International Wafer-Level Packaging Conference (IWLPC) Nov. 11-13 in San Jose, Calif. Dr. Lee's tutorial, Achieving High Reliability Lead-Free Soldering - Materials Considerations, will take place Nov. 13 from 1:30-5:00 p.m.
