Industry News: thin film packaging (Page 12 of 85)

Engineered Conductive Materials Debuts DB-1538-2 Ribbon Attach Conductive Adhesive

Industry News | 2011-07-06 07:52:00.0

Engineered Conductive Materials introduces its DB-1538-2 Conductive Stringer Attach Adhesive, which is designed for use in thin-film, organic and thinned silicon solar modules.

Engineered Conductive Materials, LLC

PFC Flex meets high speed application requirements

Industry News | 2010-06-28 19:23:30.0

PFC Flexible Circuits Qualifies New, High Speed DuPont™ Pyralux® TK Flexible Circuit Material

PFC Flexible Circuits Limited

Pressurex® Film Promotes Uniform Nip Pressure Distribution to Reduce Dry Film Resist PCB Lamination Defects

Industry News | 2009-08-09 16:21:55.0

Pressure-indicating Sensor Film Improves PCB Yield and Reliability

Sensor Products Inc.

Indium Corporation's Dr. Lee to Present at Pan Pacific Microelectronics Symposium

Industry News | 2009-01-21 20:01:04.0

Indium Corporation's Vice President of Technology, Dr. Ning-Cheng Lee, will present two papers, A Novel Flexible Ag (Silver) Paste and Next Level Requirements for Ultra Fine Pitch Printing, at the Pan Pacific Microelectronics Symposium held on the Big Island of Hawaii, February 10-12, 2009.

Indium Corporation

Indium Corporation Technology Expert to Present at EPTC

Industry News | 2013-11-25 19:25:17.0

Indium Corporation's Dr. Weiping Liu, research metallurgist, will present at the 15th Electronics Packaging Technology Conference (EPTC) December 11-13 in Singapore.

Indium Corporation

Indium Corporation VP of Technology to Present at ECTC

Industry News | 2014-05-14 11:57:17.0

Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will teach a professional development course at the Electronic Components and Technology Conference (ECTC) May 27-30 in Lake Buena Vista, Florida.

Indium Corporation

Indium Corporation, Kyzen Host Seminar in Taiwan

Industry News | 2014-05-15 10:32:50.0

Indium Corporation and Kyzen hosted a technical seminar on April 29 in Hsinchu, Taiwan. The seminar featured presentations by Sze Pei Lim, Indium Corporation’s technical manager for Southeast Asia, and Jason Chan, Kyzen’s technical applications manager. Each presented on a variety of topics, including low temperature alloys, cleaning semiconductor devices, and new technologies.

Indium Corporation

Sono-Tek Corporation to Deliver Presentations at Upcoming Advanced Energy Exhibitions

Industry News | 2011-02-09 13:55:00.0

Sono-Tek Corporation announces plans to deliver presentations at two upcoming alternative power exhibitions. The presentations will highlight Sono-Tek’s ultrasonic atomizing equipment for depositing nano-suspensions, such as active layer chemistries, TCO and PEDOT coatings onto thin-film solar cells, as well as catalyst inks onto fuel cell manufacturing components.

SONO-TEK CORPORATION

Indium Corporation Technology Experts to Present at IMAPS.

Industry News | 2014-08-26 14:51:55.0

Indium Corporation technology experts will share their expertise at the 47th International Symposium on Microelectronics organized by the International Microelectronics Assembly and Packaging Society (IMAPS) Oct. 14-16 in San Diego, Calif.

Indium Corporation


thin film packaging searches for Companies, Equipment, Machines, Suppliers & Information