Industry News | 2015-12-01 10:08:02.0
Nordson ASYMTEK has been honored with the 2015 Global Technology Award in the dispensing category for its Programmable Tilt + Rotate 5-Axis Fluid Dispenser. The award was presented at the Productronica expo, in Munich, Germany on November 10, 2015.
Industry News | 2018-11-14 15:51:44.0
Senior-level executives from across the global electronics industry supply chain will gather to discuss challenges and opportunities of the burgeoning and rapidly changing automotive electronics industry during the IPC Executive Forum on Advancing Automotive Electronics at IPC APEX EXPO 2019. Presented by IPC’s Hall of Fame Council on January 28, the forum will focus on automotive electronics costs, reliability and programs from concept to production.
Industry News | 2001-02-27 22:31:53.0
IPC has announced a call for papers for the IPC Annual Meeting, which takes place October 8-13, 2001, at the Rosen Centre Hotel in Orlando, FL.
Industry News | 2013-03-29 07:29:36.0
IPC – Association Connecting Electronics Industries® has opened registration for the IPC/FED Conference on Embedded Components, a forum for designers, manufacturers, suppliers and end-users of embedded component technologies to discuss the latest technological advancements.
Industry News | 2003-04-23 08:39:30.0
For their contributions to IPC and the electronics industry
Industry News | 2015-07-08 14:20:26.0
Nordson ASYMTEK, a Nordson company (NASDAQ: NDSN), a global leader in dispensing, jetting, and coating equipment and technologies, announces its new Programmable Tilt + Rotate 5-Axis Fluid Dispenser that enables the jet to dispense using 5 axes of automated control instead of only 3 axes. The additional X and Y tilt modes enable dispensing from a vertical position and at varying tilt angles along all four sides of a device and up the side of a substrate or component, especially for 3D packages, while meeting stringent requirements for precision, accuracy, and speed. It enables dispensing of underfill, encapsulant, and coating fluids around tall substrate components on PCBs, flexible circuits, and in densely populated boards; provides precision fluid delivery to multiple sides of the latest-generation mobile device cases and sub-component camera modules by moving the nozzle tip closer to a target location such as a vertical wall; and dispenses into tight corners and narrow gaps in advanced packages.
Industry News | 2010-09-22 15:01:40.0
Removing heat has become a major issue in the electronics industry as more highly integrated devices are jammed into less space and as high power devices, such as LEDs, become increasingly more common.
Industry News | 2013-05-06 18:48:35.0
IPC – Association Connecting Electronics Industries® announces an ambitious technical agenda for the IPC/FED Conference on Embedded Components.
Industry News | 2021-09-30 16:20:50.0
IPC is calling on the U.S. electronics manufacturing community to contact members of Congress about a bill that would boost investment in federal research and development (R&D) in 10 high-tech fields. We hope your media organization will help us publicize this effort.
Industry News | 2023-09-04 14:07:54.0
Taipei city – September 2023.
