Industry News | 2017-12-05 14:37:56.0
Engineered Material Systems announces the availability of 5 µm thick dry-film negative photoresists for use in micro-electro mechanical systems (MEMS), wafer level packaging and CMOS applications (metallization). This material formulation has been optimized for hot roll or vacuum lamination and processing on MEMS and IC wafers.
Industry News | 2015-10-11 16:48:23.0
Specialty Coating Systems (SCS) is pleased to announce that Dr. Rakesh Kumar, VP of Technology, will present at the International Wafer-Level Packaging Conference on Wednesday, Oct. 14, 2015 at the Double Tree San Jose Airport Hotel in San Jose, CA. Dr. Kumar will present "A High Temperature Vapor Phase Polymer for Wafer-Level Packaging" from 5-5:30p.m. in the San Carlos Room.
Industry News | 2010-04-12 01:51:10.0
Universal Instruments expands its proven Genesis Platform portfolio with the introduction of the GenesisSC Platform – a revolutionary Semiconductor solution that blends state-of-the-art flip chip assembly capabilities with the robustness and speed of the Genesis Platform.
Industry News | 2014-05-07 16:11:10.0
AI Technology (AIT) Releases Electrically and Thermally Conductive 20 Micron Wafer Level Die-Attach Film (DAF), Combines High Glass Transition Temperature and Stress Absorption with Proven Thermal Performance in Die-Attach Power Dissipation.
Industry News | 2009-10-26 15:47:52.0
NORTH BILLERICA, Mass., Oct. 26, 2009 — BTU International (Nasdaq: BTUI), a leading supplier of advanced thermal processing equipment and processes for the alternative energy and electronics manufacturing markets, today introduced Perseas™, a product platform designed specifically for the processing of Cadmium Telluride (CdTe) thin film photovoltaic cells.
Industry News | 2010-04-12 16:09:04.0
RESEARCH TRIANGLE PARK, N.C. — DuPont Circuit & Packaging Materials (CPM) introduced its newest high-performance laminate for printed circuit boards. DuPont™ Pyralux® TK flexible circuit material is a copper clad laminate and bonding film system specifically formulated with DuPont™ Teflon® fluoropolymer film and Kapton® polyimide film for high speed digital and high frequency flexible circuit applications. DuPont™ Pyralux® TK delivers the lowest dielectric constant (DK) of any thin laminate and bondply material on the market today.
Industry News | 2014-04-10 10:17:27.0
AI Technology has just increased its manufacturing capacity to more than 10 million square feet of its 10 micron thick ESP7660 series of insulating DAF for memory stacked chip applications and its 20 micron thick ESP8660 series of conductive DAF for power devices.
Industry News | 2013-05-23 21:38:41.0
International Manufacturing Services, Inc. (IMS) announces the availability of its compact Thick Film 7GHz SMT Wilkinson Power Divider.
Industry News | 2016-08-17 09:26:56.0
AI Technology, Inc. (AIT) manufactures a series of temporary bonding materials for processing temperatures up to 150 Cº. They are well accepted for grinding, dicing, etching, and deposition. AIT customers prefer AIT bonding materials over conventional wax materials specifically because AIT’s products feature ease of use and quick removal, especially for very delicate compound wafers and photonics.
