Industry News | 2010-06-23 13:52:01.0
IMAPS is proud to announce two world-renowned industry leaders as Keynote Speakers at the 43rd International Symposium on Microelectronics (IMAPS 2010, November 2-4, 2010, Raleigh Convention Center, Raleigh, NC.
International Microelectronics Assembly and Packaging Society (IMAPS)
Industry News | 2008-11-06 10:05:03.0
Pressure-Indicating Sensor Film Useful in PCB Lamination and other Applications
Industry News | 2015-03-20 09:51:33.0
THIN WAFER PROCESSING TEMPORARY BONDING ADHESIVE FILM FOR 3D WAFER INTEGRATION
Industry News | 2014-09-05 13:53:06.0
AI Technology, Inc (AIT) Develops Temporary Bonding Wax for Precision Wafer and Substrate Back-grinding and Thinning Applications. AI Technology, Inc. (AIT) has recently developed a series of temporary wax-like media that has been proven to be useful in many of these thinning applications.
Industry News | 2009-08-10 20:22:02.0
2@+/- 12.5µm and a 7µm Total Thickness Variation (TTV), DirEKt Coat wafer coating processes effectively address the needs of current and future thinned wafer products.
Industry News | 2009-06-23 20:08:52.0
NORTH BILLERICA, Mass., June 2009 — BTU International (Nasdaq: BTUI), a leading supplier of advanced thermal processing equipment for the alternative energy and electronics manufacturing markets, will highlight its next generation technologies in booth 8157 at Intersolar North America, on July 14-16, 2009 at the Moscone Center in San Francisco.
Industry News | 2009-10-01 12:28:03.0
NORTH BILLERICA, Mass., September 30, 2009 — BTU International (Nasdaq: BTUI), a leading supplier of advanced thermal processing equipment for the alternative energy and electronics manufacturing markets, announces that it will highlight leading technologies in booth 189 at the upcoming Solar Power International 2009 expo, scheduled to take place October 27-29, 2009 in Anaheim, Calif.
Industry News | 2014-08-06 12:33:35.0
Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will present at the 15th International Conference on Electronic Packaging Technology (ICEPT) Aug. 12-15 in Chengdu, China.
Industry News | 2014-04-30 13:47:54.0
Indium Corporation will feature SACm™ solder paste at SMT Hybrid Packaging May 6-8 in Nuremberg, Germany.
Industry News | 2017-02-07 16:19:24.0
Nordson MARCH introduces its PD Series Plasma Deposition Systems family, which uses plasma polymerization to deposit thin films uniformly during precision manufacturing and assembly processes to change the surface characteristics of a substrate. Plasma deposition can be used for applications in a wide range of industries, including medical, life sciences, industrial, semiconductor, MEMS, plastics, and electronics.
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