Industry News | 2023-10-30 19:21:14.0
Tresky GmbH from Hennigsdorf near Berlin will present various metallic pre-sintering processes, including the Die Transfer Film (DTF) process, at this year's productronica 2023 in Munich. Especially for bonding semiconductors such as IGBTs, SiC MOSFETs or GaN HEMTs with Ag on DBC or AMB substrates or for connecting power modules on heat sinks, metallic sintering offers a high-performance solution with maximum reliability.
Industry News | 2015-06-18 17:55:13.0
Indium Corporation and the Empire Chapter of the International Microelectronics Assembly and Packaging Society (IMAPS), in association with the State University of New York (SUNY), will host an Advanced Technology Workshop and Tabletop Exhibition on Advances in Semiconductor Packaging on Sept. 24 at SUNY Polytechnic Institute in Marcy, N.Y.
Industry News | 2016-12-27 09:47:52.0
The addition of a Hitachi FT-150 Micro-XRF analyzer allows Eastern Applied to provide third party testing of ultra thin films plus additional thickness measurements and composition analysis. The Hitachi FT-150 will also be available for demonstrations to North American facilities looking to add Micro-XRF analysis for process control.
Industry News | 2011-06-01 23:22:00.0
Finetech announces that it sold 12 bonding systems within the past year to prominent university labs and research centers. Of the 12, three systems were purchased by California universities, including a Nanofabrication Facility as well as Electrical Engineering and Physics departments.
Industry News | 2012-07-23 11:57:49.0
International Photovoltaic Equipment Association (IPVEA) announces that it has expanded its remit to help its members explore opportunities in energy storage.
Industry News | 2015-12-01 11:54:37.0
Indium Corporation was presented with the Global Technology Award for Best Products - Americas for InFORMS® high-reliability solder preforms, on Nov. 10 at Productronica in Munich, Germany.
Industry News | 2011-06-13 17:16:24.0
Sono-Tek Corporation will highlight the ExactaCoat Tabletop Coating System in Booth #2631 in the South Hall at the upcoming SEMICON West, scheduled to take place July 12-14, 2011 at the Moscone Center in San Francisco, CA.
Industry News | 2021-02-12 16:05:56.0
PVA will showcase the FCS300-ES Ultra Fine Extended Spray Valve during the 2021 IPC APEX Virtual EXPO, scheduled to take place March 9-11, 2021 online at www.ipcapexexpo.org. The valve will be featured on PVA's Delta 6 and Delta 8 selective coating platforms.
Industry News | 2010-07-16 14:59:02.0
Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, was recognized with the IEEE’s Components, Packaging, and Manufacturing Technology Society (CPMT) Electronics Manufacturing Technology Award in acknowledgement of his contributions to electronics manufacturing technology.
Industry News | 2014-03-07 14:53:11.0
Indium Corporation's Maria Durham, product specialist for semiconductor and advanced assembly materials, will present at the IMAPS Device Packaging conference on Tuesday, March 11 in Scottsdale, Arizona.
