Industry News: through hole component lead length (Page 6 of 43)

Lead Free Solders and Embedded Passives Headline Professional Development Schedule at 2003 IPC Annual Meeting

Industry News | 2003-07-08 09:48:46.0

taking place September 28-October 2, at the Minneapolis Convention Center in Minneapolis, Minn.

Association Connecting Electronics Industries (IPC)

IPC Delivers New Standard on Handling, Packaging and Storage of Printed Boards

Industry News | 2010-09-13 15:36:15.0

IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.

Association Connecting Electronics Industries (IPC)

LIVE ELECTRONICS ASSEMBLY LINE FEATURED AT ELECTRONICS MIDWEST

Industry News | 2010-09-02 16:09:40.0

Each step in the electronics assembly process will be on display and fully functioning on the show floor at Electronics Midwest, produced by IPC — Association Connecting Electronics Industries® and Canon Communications.

Association Connecting Electronics Industries (IPC)

Panasonic Broadens Solutions in New England through Creyr Innovation

Industry News | 2015-01-15 09:12:43.0

The entire portfolio of Panasonic Factory Solutions Company of America’s PCBA, Microelectronic, and Professional Service solutions is now represented by Creyr Innovation as a value-added sales representative in the New England area.

Panasonic Factory Solutions Company of America (PFSA)

SMT vs Through-hole: Choosing the Right Method

Industry News | 2023-05-30 03:58:24.0

In the ever-evolving world of electronics manufacturing, choosing the right method for printed circuit board (PCB) assembly is crucial. Two popular methods that have gained prominence over the years are surface mount technology (SMT) and through-hole technology. Each method has its own strengths and considerations, and understanding their differences is essential for making an informed decision. In this article, we will explore the advantages, factors to consider, application considerations, and industry trends related to SMT and through-hole technologies, helping you choose the right method for your specific requirements.

IBE Electronics Co., Ltd

The Application of the Pin-in-Paste Reflow Process

Industry News | 2018-10-18 10:13:08.0

The Application of the Pin-in-Paste Reflow Process

Flason Electronic Co.,limited

New fanSINKSTM Cool Hot Components in Sizes from 27mm to 70mm

Industry News | 2021-10-28 11:44:57.0

Advanced Thermal Solutions, Inc. (ATS) now provides fanSINKSTM heat sinks for component sizes ranging from 27mm to 70mm square. The wider size range accommodates hot semiconductor components, including FPGAs, ASICS and other package types used in telecomm, optics, test/measurement, military and other applications.

Advanced Thermal Solutions, Inc

How to Install Encoders - Best Practices

Industry News | 2021-11-02 21:27:05.0

The wiring and installation of rotary encoders should be conducted in strict accordance with the instructions of each product. While for general encoder installation guidelines, you should pay attention to the following aspects during your encoder mounting work.

OKmarts Industrial Parts Mall

Endicott Interconnect Technologies, Inc. Fabricates Award Winning Printed Circuit Board

Industry News | 2008-02-19 10:13:23.0

Endicott Interconnect Technologies, Inc. (EI) announced today that it has fabricated an award winning, printed circuit board for IBM Zurich Research Laboratory (ZRL).

i3 Electronics

Endicott Interconnect Technologies, Inc. Fabricates Award Winning Printed Circuit Board

Industry News | 2008-01-16 13:33:47.0

Endicott Interconnect Technologies, Inc. (EI) announced today that it has fabricated an award winning, printed circuit board for IBM Zurich Research Laboratory (ZRL).

i3 Electronics


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