Industry News | 2018-10-18 09:20:09.0
Product defects caused by the flux in the wave soldering process
Industry News | 2017-10-12 15:05:21.0
KIC is pleased to announce the release of its new Vantage network software system. The new software provides a real-time dash-board for thermal processes, accessible anywhere, from any authorized PC or mobile device. The process data is automatically stored in a central location where the engineer can quickly retrieve and share all relevant data.
Industry News | 2010-03-24 12:23:30.0
Converting from manual or semi-automatic to automated selective soldering has never been easier and more practical than with the new ESS Selective Soldering Machines from APS Novastar.
Industry News | 2024-02-09 18:12:43.0
With synchronous motion, the SELECT Synchro system boosts throughput 20-40% for most applications in a 60% smaller footprint. Can replace existing selective soldering operations to improve yield and save space for many through-hole and SMT mixed-technology soldering applications. Can help electronics manufacturers step away from wave soldering with its faster, flexible, and efficient operations, compared to typical selective soldering solutions.
Industry News | 2024-05-17 18:55:31.0
Non-stop selective soldering delivers results during electronics manufacturing to increase throughput and flexibility while reducing footprint and cost-of-ownership
Industry News | 2004-09-22 14:23:28.0
Indium Corporation of America has introduced Wave Solder Flux 3592-35 specifically developed for the Pb-free wave soldering of mixed-technology and through-hole electronic assemblies.
Industry News | 2018-10-18 11:08:03.0
Different Techniques for Plating
Industry News | 2019-11-05 22:07:01.0
Tenting a via refers to covering via with soldermask to enclose or skin over the opening. A via is a hole drilled into the PCB that allows multiple layers on the PCB to be connected to each other. A non tented via is just a via that is not covered with the soldermask layer. Leaving these vias exposed or covered has pros and cons depending on the your design and manufacturing requirements.
Industry News | 2009-01-23 02:17:04.0
OSAKA, JAPAN � January 2009 � Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the worldwide market, introduces NS-F850 rosin-based flux for lead-free wave soldering.
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
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