Industry News: through package vias (Page 8 of 218)

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2017 in San Diego

Industry News | 2016-09-22 17:27:09.0

IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 15, 2017, and will be displayed throughout the event, offering additional visibility.

Association Connecting Electronics Industries (IPC)

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2018 in San Diego

Industry News | 2017-09-19 17:02:13.0

IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 28, 2018, and will be displayed throughout the event, offering additional visibility.

Association Connecting Electronics Industries (IPC)

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2018 in San Dieg

Industry News | 2018-02-12 10:15:49.0

IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 28, 2018, and will be displayed throughout the event, offering additional visibility.

Association Connecting Electronics Industries (IPC)

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2019 in San Diego

Industry News | 2018-08-06 20:44:43.0

IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, January 30, 2019, and will be displayed throughout the event, offering additional visibility.

Association Connecting Electronics Industries (IPC)

IPC and IMAPS to Host On-Shoring Advanced Packaging and Assembly Workshop

Industry News | 2023-05-15 17:38:25.0

IPC and the International Microelectronics Assembly and Packaging Society (IMAPS) will host an "On-Shoring Advanced Packaging and Assembly," workshop July 10-12, 2023, in Washington, D.C.

Association Connecting Electronics Industries (IPC)

IPC Releases Additional Test Coupons for the IPC-2221B Gerber Coupon Generator Test Coupons provide structural integrity verification based on current printed board design technology

Industry News | 2018-05-22 12:19:27.0

IPC – Association Connecting Electronics Industries® would like to announce the release of additional test coupons for the IPC-2221B Gerber Coupon Generator, an exclusive annual subscription service for IPC member companies. The IPC-2221B Gerber Coupon Generator subscription service is the only service providing new, industry approved test coupons addressing blind, buried, stacked and staggered via structures. The most commonly used coupons for product acceptance are “AB,” “AB/R” and “D” which were introduced in 2016.

Association Connecting Electronics Industries (IPC)

Medical Electronics Symposium CALL FOR PRESENTATIONS

Industry News | 2009-04-28 01:34:33.0

The SMTA and MEPTEC are pleased to announce the combination of their 2009 Medical Electronics Symposia. The two-day technical program will be held September 16-17, 2009 in Phoenix, AZ. ASU's College of Nursing and Healthcare Innovation will co-sponsor this event.

Surface Mount Technology Association (SMTA)

IWLPC Best Papers Announced

Industry News | 2015-01-15 19:44:09.0

SMTA and Chip Scale Review magazine announced the best papers from the 2014 International Wafer-Level Packaging Conference (IWLPC.) Winners were selected from each of the three tracks covering Wafer Level Packaging, 3-D (Stacked) Packaging, and MEMS Packaging, as well as an overall Best Paper and Best of Conference winner. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.

Surface Mount Technology Association (SMTA)

SMTA Announces Call for Abstracts for Counterfeit Electronic Parts Symposium West

Industry News | 2011-06-29 16:19:46.0

SMTA and CALCE @ University of Maryland are pleased to announce the west coast venue for the Symposium on Counterfeit Electronic Parts and Electronic Supply Chain. The program will be held December 6-8, 2011 at the Crowne Plaza Anaheim Resort in Anaheim, California. Abstracts are now being accepted through August 23, 2011.

Surface Mount Technology Association (SMTA)


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