Industry News: time study (Page 10 of 27)

Don't Miss KYZEN’s QFN Design Considerations to Improve Cleaning during SMTAI

Industry News | 2014-09-19 20:19:38.0

KYZEN is pleased to announce that Dr. Mike Bixenman will present the paper titled “QFN Design Considerations to Improve Cleaning – A Follow on Study” at the upcoming SMTA International exhibition.

KYZEN Corporation

Aegis launches new Russian language website in support of its expansion into Europe

Industry News | 2017-02-01 13:16:20.0

In support of its growing presence in the Russian market, Aegis Software is inviting visitors to explore its new Russian language website, which has been designed to provide the ultimate user-friendly experience providing access detailed product information, videos, case studies, technical data and service support information in their local language.

Aegis Industrial Software Corporation

Nihon Superior’s SN100C University Research Recognized

Industry News | 2009-09-17 15:00:44.0

OSAKA, JAPAN — September 2009 — Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that research sponsored by the company was recognized by the University of Queensland as one of the best examples of a successful cooperation between the university and the industry.

Nihon Superior Co., Ltd.

Koh Young helps Matric Group Deliver Breakthrough Operational Improvements

Industry News | 2023-10-23 10:10:34.0

Koh Young Technology proudly releases another customer success story with Matric Group. This case study shows how Matric Group has leveraged their partnership with Koh Young to be one of the first in the industry to use pre-reflow AOI as a game-changer for line efficiency and improved yield. All while creating a central inspection war room to allow just one person to manage all inline inspection, increasing automation, and control and mitigating talent shortages.

Koh Young America, Inc.

Insituware Application Engineer Presenting at SMTAI

Industry News | 2021-10-18 15:09:32.0

Insituware LLC is pleased to announce that Morgan Miller, Application Engineer, will present during the SMTA International Conference, scheduled to take place Nov. 1-4, 2021 at the Minneapolis Convention Center. Ms. Miller will present: "Correlation of Solder Paste Electrochemical Impedance Spectroscopy (EIS) Measurements to Solder Paste Inspection (SPI) Performance."

Insituware LLC

ASC International Receives High Customer Satisfaction Scores

Industry News | 2016-07-20 16:40:18.0

ASC International recently completed a study contracted with an independent third-party satisfaction firm to conduct a survey regarding the company’s overall customer satisfaction rate.

ASC International

Case study: How to Create a Reflow Profile for a 16-layer, 2mm Thickness PCB with a High Density SMT Connector?

Industry News | 2018-10-18 10:18:58.0

Case study: How to Create a Reflow Profile for a 16-layer, 2mm Thickness PCB with a High Density SMT Connector?

Flason Electronic Co.,limited

Research on non-precious metal catalysts. Research progress of non-precious metal catalysts for proton exchange membrane fuel cells

Industry News | 2020-11-24 00:27:11.0

Research on non-precious metal catalysts. Research progress of non-precious metal catalysts for proton exchange membrane fuel cells

HANGZHOU CHEERSONIC UlLTRASONICS EQUIPMENTS CO.,LIMITED

Kyzen’s Cleaning Flux Residues Presentation Wins a Best Paper Award at SMTA China East Conference

Industry News | 2011-05-19 18:23:13.0

Kyzen announces that it received the Best Paper of Technology Conference Two (CE11) award for the presentation titled “Correlation Study for Cleaning Flux Residues under Component Gaps.”

KYZEN Corporation

Ersa to Present on Void Reduction in Reflow Soldering during SMTAI

Industry News | 2016-09-07 19:04:13.0

Kurtz Ersa North America is pleased to announce that Viktoria Rawinski, Assistant to the CEO of the Kurtz Ersa Group and head of the Kurtz Ersa Company Museum and the Corporate History Department, will present the paper entitled, “Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate – Process Integration in Industrial Production,” during SMTA International. The presentation is scheduled to take place during Session MFX4, entitled, “Reflow and Soldering Technology: Void Reduction” on Wednesday, September 28, 2016 from 10:30 a.m. to 12 p.m. in Room 49.

kurtz ersa Corporation


time study searches for Companies, Equipment, Machines, Suppliers & Information

SMTAI 2024 - SMTA International

Training online, at your facility, or at one of our worldwide training centers"
Electronics Equipment Consignment

Wave Soldering 101 Training Course
Circuit Board, PCB Assembly & electronics manufacturing service provider

High Throughput Reflow Oven