Industry News: tin/lead solder (Page 2 of 19)

Compact Reference Manuals to IPC-A-610E and IPC J-STD-001 Illustrate Acceptance Criteria in a Handy Format for Inspectors and Operators

Industry News | 2010-09-30 00:35:51.0

The new E revisions of IPC’s popular desk reference manuals, IPC-DRM-PTH, Through-Hole Solder Joint Evaluation Training & Reference Guide and IPC-DRM-SMT, Surface Mount Solder Joint Evaluation Training & Reference Guide have been released.

Association Connecting Electronics Industries (IPC)

Reading the Fine-Pitch — IPC-7525 Updated to Deal with New Materials

Industry News | 2012-06-09 14:33:06.0

To help designers and board assemblers address the challenges of working with new materials and smaller, finer-pitch components, IPC – Association Connecting Electronics Industries® released the B revision of IPC-7525, Stencil Design Guidelines.

Association Connecting Electronics Industries (IPC)

IPC APEX EXPO Professional Development Courses Help Industry Develop the Next Generation of Electronics

Industry News | 2011-01-10 19:20:49.0

Plans are ramping up for IPC APEX EXPO™, April 10–14 in Las Vegas, aimed at meeting the needs of the engineers, PCB designers and manufacturing wizards who are tasked with bringing today’s consumer, industrial and high-reliability electronic products to life. With a focus on education, IPC will bring industry experts from around the world to lead 50 half-day professional development courses covering critical topics in design, PCB manufacturing, electronics assembly and test — supporting electronics manufacturers as they develop the next generation of electronics.

Association Connecting Electronics Industries (IPC)

IPC Releases Market Research Report on Issues and Outlook for Lead-Free Electronics in Military and Aerospace Applications

Industry News | 2015-05-21 19:17:53.0

IPC-- Association Connecting Electronics Industries— ® has released a new market research study, "Issues and Outlook for Lead-Free Electronics in Military and Aerospace Applications." This study examines the current and future state of lead-free usage in high-reliability applications.

Association Connecting Electronics Industries (IPC)

LEADING EXPERTS TAKE TIN WHISKERS FROM THEORY TO PRACTICE AT IPC CONFERENCE Are we understating the use of tin whisker risk mitigation methodologies?

Industry News | 2012-03-26 15:58:58.0

Tin whisker growth, risk mitigation, detection and failure analysis will be the focus of the IPC Tin Whiskers Conference, April 17–19, 2012, in Ft. Worth, Texas.

Association Connecting Electronics Industries (IPC)

IPC MIDWEST TECHNICAL CONFERENCE BRINGS EXPERTISE IN MANUFACTURING DEFECT-FREE, RELIABLE ELECTRONICS

Industry News | 2011-08-18 21:23:09.0

For an industry that is constantly advancing, the technical conference at IPC Midwest Conference & Exhibition on September 21–22, in Schaumburg, Ill., will feature five sessions offering the latest research, methodologies and insights from industry experts to address critical challenges of manufacturing defect-free, quality electronics.

Association Connecting Electronics Industries (IPC)

IPC MIDWEST TECHNICAL CONFERENCE BRINGS EXPERTISE IN MANUFACTURING DEFECT-FREE, RELIABLE ELECTRONICS

Industry News | 2011-08-18 21:24:08.0

For an industry that is constantly advancing, the technical conference at IPC Midwest Conference & Exhibition on September 21–22, in Schaumburg, Ill., will feature five sessions offering the latest research, methodologies and insights from industry experts to address critical challenges of manufacturing defect-free, quality electronics.

Association Connecting Electronics Industries (IPC)

New Electronics Industry Market Data Now Available by Subscription

Industry News | 2016-07-05 17:46:03.0

IPC is introducing three new quarterly subscription reports. These exclusive reports provide electronics manufacturers a competitive edge that comes from having solid, timely and reliable market research data.

Association Connecting Electronics Industries (IPC)

Donald Tyler, Corfin, to Present “Elimination of Pb-Free Risk by Robotic Hot Solder Dip” at the SMTA Capital Chapter Meeting March 17th

Industry News | 2015-03-11 18:05:46.0

The SMTA Capital Chapter is pleased to announce Donald Tyler, Managing Director, Corfin Industries, will present “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” at its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164.

Surface Mount Technology Association (SMTA)

The SMTA Capital Chapter to Host First Meeting of the Year on March 17th at EIT

Industry News | 2015-02-04 18:05:58.0

he SMTA Capital Chapter is pleased to announce its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164. The focus of this chapter meeting will be “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” presented by Donald Tyler, Managing Director, Corfin Industries.

Surface Mount Technology Association (SMTA)


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