Industry News | 2018-12-08 03:24:24.0
RoHS Guide in Electronics: RoHS, WEEE and Lead-Free FAQ
Industry News | 2013-01-02 16:01:34.0
A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2018-12-08 03:25:54.0
Basic Soldering Guide – How to Solder Electronic Components
Industry News | 2018-10-18 09:29:21.0
Wave soldering welding interview direct contact with high temperature liquid in the production
Industry News | 2010-11-19 14:33:06.0
Steve Wozniak, co-founder of Apple Computer, will be trekking out to IPC APEX EXPO to keynote and hang out with “his kind of people.” IPC invites you to join "the Woz" and your colleagues in electronics manufacturing at IPC APEX EXPO 2011
Industry News | 2013-01-19 07:46:16.0
Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics
Industry News | 2014-05-05 16:03:12.0
IPC’s Pb-Free Electronics Risk Management (PERM) Council has released a white paper, “PERM Council Pb-free Research Priorities” that identifies priority research areas regarding the impact and risks associated with the implementation of lead-free materials in electronics.
Industry News | 2010-09-13 15:36:15.0
IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.
Industry News | 2010-08-25 14:54:48.0
Industry experts will shine the spotlight on recent revisions to key electronics manufacturing industry standards and guidelines during IPC’s professional development program at Electronics Midwest. On September 27 and September 29–30, half-day, in-depth workshops will address major updates to the standards that establish electronics manufacturing requirements and acceptability criteria worldwide. In addition, a workshop covering industry best practices, new and emerging developments and future trends in materials and processes for packaging and assembly will be offered.
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