Industry News | 2003-06-11 08:00:48.0
IPC has begun a comprehensive study of the three leading lead-free alloys (Tin-Silver-Copper) in an effort to analyze the properties of the leading candidates for lead-free assembly.
Industry News | 2003-08-27 10:43:02.0
This 41-page document is the complete source for printed circuit board and electronics assembly standards and publications for design, materials, manufacturing, assembly, quality and test.
Industry News | 2003-05-01 08:15:48.0
Will take place February 23-27, 2004, at the Anaheim Convention Center in Anaheim, Calif.
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