Industry News: tin mitigation (Page 1 of 8)

LEADING EXPERTS TAKE TIN WHISKERS FROM THEORY TO PRACTICE AT IPC CONFERENCE Are we understating the use of tin whisker risk mitigation methodologies?

Industry News | 2012-03-26 15:58:58.0

Tin whisker growth, risk mitigation, detection and failure analysis will be the focus of the IPC Tin Whiskers Conference, April 17–19, 2012, in Ft. Worth, Texas.

Association Connecting Electronics Industries (IPC)

Newly Updated IPC-AJ-820A Provides Nitty-Gritty of Electronics Assembly and Soldering

Industry News | 2012-03-21 17:42:19.0

For many designers and manufacturing personnel in the electronics manufacturing supply chain, IPC-AJ-820, Assembly and Joining Handbook, is the document of choice for all aspects involved in creating a PCB.

Association Connecting Electronics Industries (IPC)

IPC and CALCE Present 7th International Symposium on Tin Whiskers Event to Feature Experts from CALCE, Lockheed Martin and Other Leading Organizations

Industry News | 2013-10-01 18:21:25.0

IPC — Association Connecting Electronics Industries® and its educational partner, CALCE® (Center for Advanced Life Cycle Engineering) at the University of Maryland, will host the 7th International Symposium on Tin Whiskers, November 12–13, 2013, in Costa Mesa, Calif.

Association Connecting Electronics Industries (IPC)

Is Stress the Root of Tin Whisker Growth? Brown University professor and other experts to present research at 7th International Tin Whiskers Symposium

Industry News | 2013-11-01 16:09:44.0

Eric Chason, Ph.D., professor of engineering at Brown University, will present his tin whisker research at the 7th International Tin Whiskers Symposium, November 12–13 in Costa Mesa, Calif., hosted by IPC with academic partner CALCE.

Association Connecting Electronics Industries (IPC)

Call for Participation - Get More Bang for Your Buck with Two Presentation Opportunities in Denmark

Industry News | 2009-03-02 00:48:35.0

The SMTA and CALCE/University of Maryland are pleased to announce their industry premier in Denmark with two co-located events focusing respectively on Tin Whiskers and Counterfeit Electronic Parts issues. The events will be held June 23-26, 2009 at the Technical University of Denmark in Lyngby and are supported by the Centre for Electronic Corrosion (CELCORR) and ATV-SEMAPP at the Technical University of Denmark.

Surface Mount Technology Association (SMTA)

IPC & SMTA High-Reliability Cleaning & Conformal Coating Conference to Present “Research Methods for Mitigating Field Failures” Session

Industry News | 2014-10-12 19:48:10.0

Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference scheduled to take place November 18-20, 2014 at the Chicago Marriott in Schaumburg, IL.

Association Connecting Electronics Industries (IPC)

SMTA Capital Announces Speakers for their Vendor Day

Industry News | 2011-07-18 12:24:54.0

The Capital Chapter is pleased to announce the second technical presentation for their Expo and Tech Forum which will be held at the Johns Hopkins University, in Laurel MD on September 13, 2011.

Surface Mount Technology Association (SMTA)

SMTA Announces Co-Located June Events in Denmark

Industry News | 2009-02-24 13:53:56.0

Minneapolis, MN � The SMTA is pleased to announce its industry premier in Denmark with two co-located events focusing respectively on Tin Whiskers and Counterfeit Electronic Parts issues. The events will be held from June 23-26, 2009 at the Technical University of Denmark in Lyngby.

Surface Mount Technology Association (SMTA)

SMTA Announces International Conference on Soldering and Reliability (ICSR) Program

Industry News | 2013-04-02 17:20:44.0

The SMTA is pleased to announce the program for the 2013 International Conference on Soldering and Reliability being held May 14-17 in Toronto, Ontario, Canada.

Surface Mount Technology Association (SMTA)

International Conference on Soldering and Reliability (ICSR) Best of Conference Announced

Industry News | 2013-06-26 09:09:19.0

The SMTA announced Harald Grumm from Christian Koenen GmbH as the recipient of the Best of Conference Award for his presentation “The Potential of Stencil Technology – Choosing the Right Stencil Options to Maximize Yield and Earnings” at the 9th Annual International Conference on Soldering and Reliability, held May 14-17, 2013 at the Sheraton Toronto Airport, Ontario, Canada.

Surface Mount Technology Association (SMTA)

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