Industry News | 2012-03-26 15:58:58.0
Tin whisker growth, risk mitigation, detection and failure analysis will be the focus of the IPC Tin Whiskers Conference, April 17–19, 2012, in Ft. Worth, Texas.
Industry News | 2011-07-18 12:24:54.0
The Capital Chapter is pleased to announce the second technical presentation for their Expo and Tech Forum which will be held at the Johns Hopkins University, in Laurel MD on September 13, 2011.
Industry News | 2013-11-01 16:09:44.0
Eric Chason, Ph.D., professor of engineering at Brown University, will present his tin whisker research at the 7th International Tin Whiskers Symposium, November 12–13 in Costa Mesa, Calif., hosted by IPC with academic partner CALCE.
Industry News | 2013-10-01 18:21:25.0
IPC — Association Connecting Electronics Industries® and its educational partner, CALCE® (Center for Advanced Life Cycle Engineering) at the University of Maryland, will host the 7th International Symposium on Tin Whiskers, November 12–13, 2013, in Costa Mesa, Calif.
Industry News | 2009-02-24 13:53:56.0
Minneapolis, MN � The SMTA is pleased to announce its industry premier in Denmark with two co-located events focusing respectively on Tin Whiskers and Counterfeit Electronic Parts issues. The events will be held from June 23-26, 2009 at the Technical University of Denmark in Lyngby.
Industry News | 2009-03-02 00:48:35.0
The SMTA and CALCE/University of Maryland are pleased to announce their industry premier in Denmark with two co-located events focusing respectively on Tin Whiskers and Counterfeit Electronic Parts issues. The events will be held June 23-26, 2009 at the Technical University of Denmark in Lyngby and are supported by the Centre for Electronic Corrosion (CELCORR) and ATV-SEMAPP at the Technical University of Denmark.
Industry News | 2013-05-15 11:48:55.0
IPC – Association Connecting Electronics Industries® and the Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland have issued a call for papers for the 7th International Symposium on Tin Whiskers.
Industry News | 2015-03-11 18:05:46.0
The SMTA Capital Chapter is pleased to announce Donald Tyler, Managing Director, Corfin Industries, will present “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” at its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164.
Industry News | 2015-02-04 18:05:58.0
he SMTA Capital Chapter is pleased to announce its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164. The focus of this chapter meeting will be “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” presented by Donald Tyler, Managing Director, Corfin Industries.
Industry News | 2014-05-05 16:03:12.0
IPC’s Pb-Free Electronics Risk Management (PERM) Council has released a white paper, “PERM Council Pb-free Research Priorities” that identifies priority research areas regarding the impact and risks associated with the implementation of lead-free materials in electronics.
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