Industry News | 2006-05-04 17:10:18.0
Documents to help manufacturers reduce the risk of tin whiskers in Pb-free products
Industry News | 2006-04-17 16:53:02.0
Event co-sponsored by iNEMI, the IEEE CPMT Society and ECTC
Industry News | 2023-07-19 09:52:10.0
The re-balling of BGA components from lead-free to tin-lead solder is a critical requirement by some high-reliability customer applications due to tin-whisker mitigation concerns. This technical paper by Circuit Technology Center discusses the key process steps of this highly specialized process.
Industry News | 2022-01-24 18:01:46.0
Available component modification services utilizing Hentec/RPS Odyssey RHSD systems include BGA de-balling, gold mitigation, lead tinning and tin whisker mitigation.
Industry News | 2013-11-05 22:51:20.0
Indium Corporation's Dr. Ning-Cheng Lee, Vice President of Technology, and Dr. Ron Lasky, Senior Technologist, will present at the SMTA/iNEMI Medical Electronics Symposium November 13-14 in Milpitas, California.
Industry News | 2012-10-29 15:37:50.0
Murrietta Circuits now offers an entire menu of Re-Tinning capabilities
Industry News | 2018-11-20 06:46:05.0
The Electronics Interconnection Group’s webinars are now in their 8th year. The Group is internationally recognised for its practical and innovative work on lead-free reliability, PCB interconnection failures, tin whisker migration and conformal coating research http://www.npl.co.uk/science-technology/electronics-interconnection/webinars/
Industry News | 2021-01-26 11:24:31.0
New Vishay Vitramon MLCCs with Lead-Bearing Finish Termination Offer Tin Whisker Mitigation and Automotive Grade Reliability for Aerospace Applications
Industry News | 2021-06-07 11:44:52.0
Photon steam aging system provides accelerated life testing simulating elongated storage conditions for high reliability applications.
Industry News | 2019-01-12 07:53:43.0
Indium Corporation’s Dr. Ronald C. Lasky, Senior Technologist, and Jonas Sjoberg, Associate Director – Global Tech Services, will present at Pan Pacific Microelectronics Symposium 2019 (PanPac) in Kauai, Hawaii, USA, Feb. 11-14, 2019.
