Industry News: topside board temperature (Page 1 of 119)

Largest Dispensing Platform in the Industry

Industry News | 2017-04-11 21:19:32.0

GPD Global offers versatile large format inline dispensing systems and stand-alone liquid dispense technologies for maximizing product yield. This is the largest standard PCB dispensing system platform in the industry.

GPD Global

Evaluation Kit for Novel Board-to-board Jumpers

Industry News | 2003-03-04 08:08:23.0

In a move that broadens its interconnect design services, Micromark C and CD has introduced a new development kit for the Flexstrip jumpers flexible interconnect system.

SMTnet

No Solder Required for Press-fit D-subs

Industry News | 2003-04-08 10:28:06.0

A new range of high-performance press-fit D-subminiature terminations from GTK can be fitted easily to PCBs without the need for solder.

SMTnet

Tin Whisker Joint Meeting Held in Tokyo

Industry News | 2003-06-23 08:49:39.0

Three Organizations from the US, Europe and Japan to

SMTnet

Point-of-load Convertors Extend to 40W

Industry News | 2003-03-06 08:10:20.0

Astec Power has expanded its popular APC-Centauri surface-mount product line to include a series of 40W point-of-load DC/DC convertors.

SMTnet

SMT Workshop Planning Precautions---KINGSUN

Industry News | 2023-08-29 07:36:15.0

"DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD" provides overall solutions for SMT equipment and 3C intelligent factories.

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Clariant Masterbatches introduces new colors for high temperature resins used in FAKRA connectors

Industry News | 2020-03-05 17:49:27.0

-14 colors comply with automotive industry requirements and UL standards -Globally available in small quantities as production ramps up -Connectors needed in next-generation automobiles

Clariant Cargo & Device Protection

Camalot Announces PCB Temperature Monitoring on Prodigy Dispenser to Ensure Underfill Process Stability

Industry News | 2020-04-14 18:28:48.0

ITW EAE is introducing a patent pending option for the Camalot Prodigy dispenser that was developed to ensure process stability and increase yields for underfill applications. In applications where board heat is required, a constant product temperature through the dispense process is critical to ensure process stability and repeatability. Underfill materials vary in viscosity and filler types, therefore the heat requirement for the board also varies.

ITW EAE

Electrovert 'DwellFlex 4.0' Wave Solder Nozzle Wins New Product Innovation Award at IPC APEX 2020

Industry News | 2020-04-14 18:49:39.0

EAE, the Electronic Assembly Equipment division of ITW is the proud recipient of an IPC APEX 2020 New Product Innovation (NPI) Award. The award recognizes the Electrovert DwellFlex 4.0 wave solder nozzle.

ITW EAE

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