Industry News | 2008-11-25 17:06:43.0
Release Date: 1-Oct-2008
Industry News | 2009-10-16 19:21:16.0
FINETECH will showcase the +/- 0.5 micron placement accuracy FINEPLACER® Lambda in booth 515 at the upcoming IMAPS 2009 exhibition, scheduled for November 3-5, 2009, at the San Jose Convention Center in San Jose, Calif.
Industry News | 2010-01-07 20:09:26.0
FINETECH will showcase the +/- 0.5 micron placement accuracy FINEPLACER® Lambda in booth 1026 at the upcoming SPIE Photonics West exhibition, scheduled for January 23-28, 2010 at the Moscone Center in San Francisco, CA.
Industry News | 2008-04-07 21:09:26.0
FINETECH announces that it will display the FINEPLACER� Lambda system at the upcoming NEPCON China 2008 trade show and exhibition, scheduled to take place April 8 to 11, 2008, in Shanghai, China. This high precision bonder provides a placement accuracy of � 0.5 micron.
Industry News | 2011-05-27 23:19:01.0
Universal Instruments has announced a limited-time promotion on a scalable production line featuring the company’s award-winning Advantis 3 Platform. This new platform was recognized, at this year’s IPC APEX tradeshow, with a Circuits Assembly NPI Award. This specially configured line features scalable performance and class-leading technology for electronics manufacturing in cost-sensitive markets, and is offered through August 16, 2011 at an introductory price.
Industry News | 2012-09-04 08:51:32.0
Hesse & Knipps, Inc., (www.hesse-knipps.com) has added the HBK08 Loop Former Bondhead to its BONDJET BJ935 and BONDJET BJ939 fully automatic heavy wire bonders to support growing requirements for high density module bonding.
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