Industry News: tp11 and db (Page 1 of 2)

Electronics Workbench Announces Multisim 7 and Multicap 7 for Professional Circuit Engineers and Designers

Industry News | 2003-05-06 09:05:12.0

New Schematic Capture and Simulation Software Delivers Innovative Features and the Industry�s Best Price/Performance

SMTnet

Count On Tools Rolls Out Inline Filters and Filter Housings for MYDATA Equipment

Industry News | 2011-03-24 11:31:33.0

Count On Tools introduces MYDATA Replacement Inline Filters and Filter Housing components. Count On Tools replacement inline filters have been field tested and are proven to increase vacuum and air performance in the equipment while lasting longer than OEM versions. The new inline filters are capable of capturing particles as small as 0.1 µm.

Count On Tools, Inc.

New Low-Temperature Curing Conductive Adhesive Available for OLEDs and OPVs

Industry News | 2012-04-05 13:59:12.0

Engineered Conductive Materials introduces the low-temperature curing Conductive Adhesive DB-1541-LTC for use in organic light emitting diodes (OLED) and organic photovoltaics (OPV).

ECM Equipment Sales, Inc.

Parvus� PC104+DEV� Development Platform Offers Flexibility and Convenience for Embedded Software and Hardware Developers

Industry News | 2004-07-19 11:24:45.0

Parvus unveils benchtop development station for use with PC/104, PC/104-Plus, ISA and PCI computer boards

Parvus Corporation

Barry Industries Introduces 800W Termination with 1.12:1 VSWR for Basestation, Broadcast and Radar Applications

Industry News | 2013-12-10 12:51:58.0

Barry Industries introduces a RoHS compliant flange mount termination which dissipates 800W with minimal return loss over a DC to 1GHz bandwidth.

Barry Industries, Inc.

Saelig Introduces JRE TVK Isolation Tester for Shielding and Shielded Enclosures

Industry News | 2021-02-16 15:09:32.0

The JRE TVK Test Verification Set is a complete kit to easily and economically verify the isolation effectiveness of RF Shielded enclosures

Saelig Co. Inc.

Mentor Graphics Announces New HyperLynx Technology with Advanced 3D Channel and Trace Modeling, Superior Accuracy and Fastest Simulation Performance

Industry News | 2013-02-01 15:00:00.0

Mentor Graphics announced the newest release of its market-leading HyperLynx® product for superior high-speed design and analysis. Key features in the new HyperLynx product release include advanced 3D channel and trace modeling, improved DDR signoff verification, and accelerated simulation performance—up to 5X faster.

Mentor Graphics

Innodisk Expands Embedded Peripheral Series with Communication Modules, for IoT and Embedded Applications.

Industry News | 2014-11-14 04:05:00.0

Expansion Modules add Gigabit-Ethernet or Multiport Serial Connectivity

Innodisk Corporation

ATS Ultra-Low Temperature Freezers for Vaccine and Laboratory Cold Storage Distributed through New Yorker Electronics

Industry News | 2021-04-22 17:08:17.0

New Advanced Thermal Solutions' Devices can Continuously Store Biological Materials at Temperatures as Low as -123°F

New Yorker Electronics

ADLINK Extreme Performance ATCA Blades Launch with Refreshed Dual Intel® Xeon® Processors E5-2658 v2 and E5-2648L v2

Industry News | 2013-09-18 12:09:19.0

ADLINK Technology today announced availability of the enhanced aTCA-6250 and aTCA-6200A, AdvancedTCA® (ATCA) processor blades with robust computing power, high throughput connectivity, and accelerated packet processing capabilities.

ADLINK Technology, Inc.

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