Industry News: tracks (Page 6 of 135)

SMTA International Technical Program Expands, Includes Research from HDPUG and AREA Consortium

Industry News | 2017-07-23 20:13:17.0

SMTA announces an expanded program for the final day of the SMTA International Conference, September 17 - 21, 2017 in Rosemont, Illinois. In addition to the Lead-Free Symposium, the technical committee expanded the Thursday program to four concurrent tracks. The three additional tracks will focus on Advanced Packaging Technology, Manufacturing Excellence, and Inspection Technologies.

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Program Announced and Registration Now Open

Industry News | 2019-07-16 19:36:51.0

The Surface Mount Technology Association (SMTA) and Chip Scale Review are pleased to announce the program for the 16th annual International Wafer-Level Packaging Conference (IWLPC). The conference will be held October 22-24, 2019 at the DoubleTree by Hilton Hotel in San Jose, California.

Surface Mount Technology Association (SMTA)

Wafer-Level Packaging Symposium (WLPS) Program Announced and Registration Now Open

Industry News | 2021-12-21 14:47:13.0

The SMTA is pleased to announce the technical program for the Wafer-Level Packaging Symposium (WLPS). The symposium will be held February 15-17, 2022 at the DoubleTree by Hilton Hotel in San Jose, California.

Surface Mount Technology Association (SMTA)

IWLPC Technical Committee Announces Best Presentation & Papers Awards for 2017

Industry News | 2018-02-02 18:44:38.0

The IWLPC Technical Committee is pleased to announce the Best of Conference, Best Presentation & Best Papers in WLP, 3D, Advanced Manufacturing and Test tracks as chosen by the technical committee and attendees based on technical merit, relevance, originality, knowledge of subject, quality of material, and quality of presentation. 

Surface Mount Technology Association (SMTA)

IWLPC Celebrates a Successful 10 Years

Industry News | 2013-11-26 14:46:08.0

The 2013 International Wafer-Level Packaging Conference (IWLPC), organized by SMTA and Chip Scale Review magazine, celebrated its 10th consecutive annual event on November 5-7, 2013 with a very successful conference and exhibition. Technical presentations covered a large range of applications, challenges, and solutions. This 10th anniversary event with over six hundred total participants had thirty-nine presentations in three parallel tracks over the two days.

Surface Mount Technology Association (SMTA)

iNEMI, SMTA, MEPTEC and OregonBio to Co-Host Medical Electronics Symposium

Industry News | 2014-03-27 14:15:48.0

The 9th Annual Medical Electronics Symposium will be held at Marylhurst University near Portland, Oregon, on September 18-19, 2014. SMTA, iNEMI, MEPTEC and OregonBio have joined forces to host this year’s international symposium, which will focus on advances in electronic technologies and advanced manufacturing, specifically targeting medical and bioscience applications.

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Program Announced and Registration Now Open

Industry News | 2017-07-19 15:29:48.0

The SMTA and Chip Scale Review are pleased to announce the program for the 14th annual International Wafer-Level Packaging Conference. The IWLPC will be held October 24-26, 2017 at the DoubleTree by Hilton Hotel in San Jose, California.

Surface Mount Technology Association (SMTA)

2009 International Wafer-Level Packaging Conference Dates and Location Announced

Industry News | 2008-12-02 14:39:08.0

Minneapolis, MN � The SMTA and Chip Scale Review Magazine are pleased to announce the dates for the 2009 International Wafer-Level Packaging Conference. The 6th annual offering of the IWLPC will be held on October 27-30, 2009 at the Santa Clara Marriott in Santa Clara, California.

Surface Mount Technology Association (SMTA)

2009 International Wafer-Level Packaging Conference Dates and Location Announced

Industry News | 2008-12-06 02:26:28.0

Minneapolis, MN � The SMTA and Chip Scale Review Magazine are pleased to announce the dates for the 2009 International Wafer-Level Packaging Conference. The 6th annual offering of the IWLPC will be held on October 27-30, 2009 at the Santa Clara Marriott in Santa Clara, California.

Surface Mount Technology Association (SMTA)


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