Industry News | 2021-02-03 13:41:02.0
Changing technologies, advanced materials and new processes that are driving the electronics manufacturing industry will take center stage throughout the IPC APEX EXPO 2021 technical conference and professional development sessions, which will take place virtually March 8-12. Registration is now open at www.IPCAPEXEXPO.org.
Industry News | 2019-04-23 07:43:52.0
IPC announces the release of IPC-2591, Connected Factory Exchange (CFX). The electronics industry now has an industry standard available to all companies in the industry, regardless of size or location which can be used to quickly and easily implement “Industry 4.0” and “smart factory” applications to their manufacturing operations.
Industry News | 2022-02-07 17:26:54.0
From revolutionary innovations displayed on the show floor to expert insights conveyed in technical conference sessions, professional development courses and standards development committee meetings, IPC APEX EXPO 2022 provided the education and networking connections that helped 3,647 visitors address today's business challenges and prepare for their factories of future.
Industry News | 2003-03-31 09:51:04.0
The SMTA has formed the SMTA International Technical Committee for 2003.
Industry News | 2003-04-21 10:24:56.0
Learning today for tomorrow's demands
Industry News | 2008-11-07 01:43:34.0
Minneapolis, MN � Industry professionals are invited to submit a paper for SMTA International 2009, the electronic industry's premier conference on the manufacture of electronic products and related business practices. This year's event will be held October 4 to 8, 2009 at the Town and Country Resort and Convention Center in San Diego, CA.
Industry News | 2009-07-24 14:12:49.0
Minneapolis, MN – The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 6th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 27-30, 2009 at the Santa Clara Marriott Hotel in Santa Clara, California.
Industry News | 2010-02-01 13:36:36.0
Minneapolis, MN - The SMTA, in conjunction with Chip Scale Review magazine, is pleased to release the Call for Papers for the 7th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition (IWLPC) to be held October 11-14, 2010 at the Marriott Santa Clara Hotel in Santa Clara, CA. The IWLPC Technical Chair, Lee Smith of Amkor Technology, and the IWLPC Technical Committee would like to invite you to submit an abstract for this program on or before April 23, 2010.
Industry News | 2010-06-28 16:44:36.0
The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 7th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 11-14, 2010 at the Santa Clara Marriott Hotel in Santa Clara, California. Registration is now available on-line. Early Bird conference pricing is in effect until September 10, 2010, after which registration prices will go up $100.
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