Industry News: transfer efficiency (Page 7 of 38)

Licensed Stencil Manufacturers Feature Florida CirTech’s NanoSlic Coating

Industry News | 2016-02-24 15:57:12.0

Introduced to the electronics market in 2014, NanoSlic is a proprietary thermoset polymer coating that renders metals, glass and polymers hydrophobic and oleophobic for improved protection and performance. FCT has developed not only the breakthrough chemistry, but also the equipment and application process that provide a turnkey stencil coating solution, NanoSlic Gold. Though used in multiple markets (www.nanoslic.com) for various safeguarding purposes, for electronics assembly applications, NanoSlic-coated stencils dramatically improve printing performance.

FCT ASSEMBLY, INC.

Kyzen's Dr. Mike Bixenman to Discuss Compatibility of Cleaning Agents at SMTAI 2011

Industry News | 2011-09-23 22:31:43.0

Kyzen announces that Dr. Mike Bixenman will present “Compatibility of Cleaning Agents with Nano-Coated Stencils” at the upcoming SMTA International Conference & Exhibition

KYZEN Corporation

Indium Corporation snaps up DEK Horizon 01iX at Productronica 2011

Industry News | 2011-12-21 17:56:02.0

DEK has signed a contract with The Indium Corporation for its print platform, Horizon 01iX. The order for the print platform was finalised on the second day of Productronica 2011 in Munich.

ASM Assembly Systems (DEK)

Indium8.9HF1-P Delivers High First Pass Yields for In-circuit Testing

Industry News | 2013-12-10 12:14:34.0

Indium Corporation introduces a new Pb-free solder paste designed to combine best-in-class stencil printing performance, using Indium's unique halogen-free oxidation barrier technology with optimized no-clean residues for enhanced probe testing. Indium8.9HF1-P saves time and money on testing by eliminating false failures and giving the highest first pass yields.

Indium Corporation

FCT Assembly Launches NanoSlic® Gold Stencil

Industry News | 2014-01-22 11:00:42.0

FCT Assembly announces the launch of the NanoSlic® Gold stencil. NanoSlic® is the world’s most advanced stencil technology for solder paste printing.

FCT ASSEMBLY, INC.

FCT Assembly to Debut NanoSlic® Gold Stencil at IPC APEX EXPO

Industry News | 2014-02-18 17:14:55.0

FCT Assembly will debut the new NanoSlic® Gold stencil in Booth #2175 at the IPC APEX EXPO, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, Nevada.

FCT ASSEMBLY, INC.

Indium10.1 Pb-Free Solder Paste Provides Lowest Voiding Levels for Large Ground Planes

Industry News | 2014-04-30 13:42:31.0

Indium Corporation's Indium10.1 Solder Paste is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes.

Indium Corporation

Indium Corporation Announces RMA-155 Pb-Free Solder Paste.

Industry News | 2014-07-09 10:22:05.0

Indium Corporation recently released RMA-155 Pb-Free Solder Paste. RMA-155 is the best solder paste for customers who are required to use RMA materials, but who need the performance benefits of modern Pb-free solder paste technology.

Indium Corporation

Indium Corporation Features Indium10.1 Pb-Free Solder Paste at SMTAi.

Industry News | 2014-08-05 17:29:07.0

Indium Corporation will feature its new solder paste, Indium10.1, at the SMTAi 2014. Indium10.1 is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes.

Indium Corporation

See FCT Assembly’s Technical Experts in Pennsylvania Next Week

Industry News | 2014-08-07 17:58:07.0

FCT Assembly today announced plans to exhibit at the SMTA Philadelphia and SMTA West Penn Expos.

FCT ASSEMBLY, INC.


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