Industry News: transition temperature (Page 1 of 17)

IPC Releases E-Textiles Standard IPC-8921

Industry News | 2020-01-07 11:09:15.0

IPC-8921 establishes classifications and designations for woven and knitted e-textiles integrated with e-fibers, e-yarns and e-wires. It also standardizes key characteristics and durability testing for these materials as well as the industry test methods to be used to test against those characteristics.

Association Connecting Electronics Industries (IPC)

Raw Material Choices for PCBs

Industry News | 2018-10-18 11:10:33.0

Raw Material Choices for PCBs

Flason Electronic Co.,limited

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

How to Prevent Solder Joint Voiding and Cold Solder Defects during the SMT Reflow Process

Industry News | 2018-10-18 08:17:09.0

How to Prevent Solder Joint Voiding and Cold Solder Defects during the SMT Reflow Process

Flason Electronic Co.,limited

Solder Joint Reliability

Industry News | 2018-10-18 08:49:15.0

Solder Joint Reliability

Flason Electronic Co.,limited

The SMTA Capital Chapter Invites You to Attend Its Annual Expo and Tech Forum on August 23, 2012

Industry News | 2012-08-09 18:20:49.0

The SMTA Capital Chapter is pleased to invite you to its upcoming Capital Expo and Tech Form at Johns Hopkins Applied Physics Lab, 11100 Johns Hopkins Road, Laurel, MD 20723, on August 23, 2012 from 9:00 am until 3:00 pm.

Surface Mount Technology Association (SMTA)

IPC Releases New IPC/PERM-2901, Pb-free Design and Assembly Implementation Guide IPC-PERM-2901 addresses the impact of Pb-free on reliability and service life for aerospace, defense and high-performa

Industry News | 2018-02-19 13:55:53.0

IPC — Association Connecting Electronics Industries® Pb-free Electronics Risk Management (PERM) Council has developed the first single document dedicated solely to assisting design engineering in the development of electronics that are completely lead-free (Pb-free) and meet the demanding requirements of aerospace, defense and high performance (ADHP) products and systems.

Association Connecting Electronics Industries (IPC)

Engineered Material Systems Debuts Low-Temperature Cure/Snap Cure Conductive Adhesive for Die-Attach Applications

Industry News | 2014-02-11 15:25:57.0

Engineered Material Systems introduces the CA-180 Low Temperature Cure/Snap Cure Conductive Adhesive designed for die-attach applications in smart cards, circuit assembly, photonics or camera modules.

Engineered Materials Systems, Inc.

Engineered Material Systems Releases New Conductive Adhesive for Solder Replacement Applications

Industry News | 2013-09-24 14:26:38.0

Engineered Material Systems debuts its CA-102 Conductive Adhesive designed for bonding components to circuit boards.

Engineered Materials Systems, Inc.

Engineered Material Systems Releases Die Attach for Light Emitting Diodes and Small Power Semiconductor Devices

Industry News | 2012-02-15 19:12:30.0

Engineered Material Systems has released its new DA-5045-2 and DA-5045-4 High Thermal Conductivity Die Attach Adhesives for attaching light emitting diodes (LEDs) and small die.

Engineered Materials Systems, Inc.

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