Industry News: trapped (Page 2 of 6)

Conference, May 22-24, 2017 in Amsterdam

Industry News | 2017-04-11 21:21:11.0

KYZEN today announced plans to participate in the Contamination, Cleaning & Coating Conference, scheduled to take place May 22-24, 2017 in Amsterdam. The event is co-organized by SMTA and SMART Group. Mike Bixenman, DBA, KYZEN Corporation will present “Development of a Risk Profile from Flux Residues Trapped under Leadless Components” in Session I entitled “Residues Trapped under Component Terminations”.  All presentations in this session will address a common question faced by OEMs when designing electronic hardware: How clean is clean enough?

KYZEN Corporation

KYZEN’s Dr. Mike to Present No-Clean Flux Residue Study Findings at SMTAI

Industry News | 2016-09-07 18:44:03.0

KYZEN announces that Dr. Mike Bixenman will present the recent paper entitled, “Reactivity of No-Clean Flux Residues Trapped Under Bottom Terminated Components” during SMTA International. The paper is co-authored by Bruno Tolla, Ph.D., Jennifer Allen and Kyle Loomis from Kester and will be presented during the “Flux, Solder, Adhesives Track” on Tuesday, September 27, 2016 at 3 p.m.

KYZEN Corporation

Kester To Present at the SMTA South East Asia Technical Conference on Electronics Assembly

Industry News | 2017-03-10 16:38:39.0

On Wednesday, March 29 Kester’s Bruno Tolla and Kyzen’s Mike Bixenman will present “Development of a Risk Profile from Flux Residues Trapped under Leadless Components” at the SMTA South East Asia Technical Conference on Electronics Assembly.

Kester

Lattice from Light Bulbs Could Boost Communication, Vehicle Power

Industry News | 2002-05-13 08:43:26.0

Microscopic Cage that Traps Heat and Light that Would Normally Escape from a System and Transforms It into Usable Energy

Sandia National Laboratories

Dr. Mike Bixenman Discusses Non-Standard Test Methods at ICSR

Industry News | 2017-05-22 17:36:43.0

KYZEN is pleased to announce that Mike Bixenman, DBA will present at the International Conference on Soldering & Reliability (ICSR) held in conjunction with the Toronto SMTA Expo & Tech Forum. Bixenman will present the paper entitled, “Reliable Microelectronic Assembly Process Design Test Methods – A Non-Standard Approach” at 2:30 p.m. on Wednesday, June 7, 2017 at the Edward Village Markham in Ontario.

KYZEN Corporation

Seika Machinery, Inc.'s SPR Unit Proven to Produce Pure Solder Ingots

Industry News | 2011-10-28 20:59:38.0

Seika Machinery announces that an independent lab has confirmed that its Solder Paste Recycling (SPR) machine is capable of producing pure solder ingots from solder paste.

Seika Machinery, Inc.

BTU International to Launch Pyramax 100 Range at Productronica 2007

Industry News | 2007-11-01 20:23:59.0

Farnborough, UK -November 2, 2007� BTU Europe, a leading supplier of advanced thermal processing equipment for the electronics manufacturing and alternative energy generation markets, announces it will launch the Pyramax 100 range in hall A4, booth 141 at the upcoming Productronica 2007 exhibition and conference scheduled to take place November 13-16, 2007 at the Munich Trade Fair Center in Munich, Germany.

BTU International

How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process

Industry News | 2018-10-18 08:32:52.0

How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process

Flason Electronic Co.,limited

Transition Automation Introduces New Slim-LineTM Universal Squeegee Holder

Industry News | 2023-01-09 18:17:22.0

Transition Automation, Inc. is pleased to announce the release of a new "Slim-Line Tool Free" Squeegee Holder System at this year's IPC APEX EXPO Trade Show in booth #3325. The new holder design is aptly named SlimLine to highlight the flat front surface and lack of screws or clamp bar features. This new holder design is our first "tool free" holder that allows for blade changes without the use of screwdrivers, nut wrenches or other tools. The new design incorporates magnets to secure the main body of the squeegee blade and unique end "locks" that have a very low profile. The result is a holder that provides a complete smooth front blade surface. The benefit of this design is that the squeegee blade does not have any protruding elements that typically interfere with solder paste rolling. Clamp bars, screws and hardware located in the front of the squeegee cause interruption and difficulty when maintaining squeegees. Screws get clogged with dried solder paste and paste will stick on any protruding surface. By eliminating these protruding elements, this new squeegee holder improves print quality and cleaning ability. Now, users can simply swipe across the front squeegee and obtain complete cleaning with a smooth spatula. This design is available for all SMT printers and maintains similar design outline as previous Transition Automation holder geometries. Another goal of the new design is to minimize interstitial spaces where cleaning fluid and paste can be trapped.

Transition Automation, Inc.

Kyzen's Mike Bixenman to Present at SMTA Upper Midwest Expo & Tech Forum

Industry News | 2009-05-29 10:09:26.0

NASHVILLE � May 2009 � Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that Mike Bixenman will present at the upcoming SMTA Upper Midwest Expo & Tech Forum.

KYZEN Corporation


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