Industry News | 2024-03-18 11:53:13.0
Inovaxe is gearing up for a strong presence at the upcoming 2024 IPC APEX EXPO. The company is poised to showcase its cutting-edge product lineup, promising to redefine inventory management and enhance production efficiency in Booth 1808. The 2024 IPC APEX EXPO is scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California.
Industry News | 2024-05-20 10:28:23.0
Inovaxe is pleased to announce its participation at the upcoming SMTconnect exhibition, scheduled to take place June 11-13, 2024 in Nuremberg, Germany.
Industry News | 2018-10-11 19:55:58.0
Aegis Software and Inovaxe have teamed up to provide an integrated solution that delivers ultra-lean material handling, storage, and production capabilities. This complementary combination will help manufacturers improve productivity, reduce labor and inventory costs, maximize yield, optimize floor space, and minimize unplanned downtime, ultimately increasing quality, revenues, and customer satisfaction.
Industry News | 2012-06-12 13:07:13.0
ABB Semiconductors in Lenzburg, Switzerland, long searched for a suitable production storage system for HiPak IGBT modules production. Project Manager Prabath Lewdeni found the SMD Tower by chance. Its supplier Essemtec re-engineered the SMD component storage system into clean room storage for ABB.
Industry News | 2016-09-07 12:47:48.0
ADLINK Technology announces its new MXC-6400 Series of high-performance expandable fanless embedded computers, featuring 6th generation Intel® Core™ i7/ i5/ i3 processors (codename Skylake) and the QM170 chipset. Along with leading performance, high storage density from 4x 2.5" SATA drives, and rugged fanless construction withstanding operating shock up to 50G and vibration to 5Grms, the MXC-6400 Series fully meets the needs of Intelligent Transportation Systems for rolling stock, maritime operations, in-vehicle infotainment, and high-speed data processing and mission-critical industrial automation.
Industry News | 2019-05-31 08:50:57.0
Non-destructive testing of 3D packages with scanning acoustic microscopes identifies defects down to sub-micron level for 100% inspection, failure analysis
Industry News | 2019-05-31 08:56:07.0
Non-destructive testing of 3D packages with scanning acoustic microscopes identifies defects down to sub-micron level for 100% inspection, failure analysis
