Industry News: tray siemens (Page 1 of 1)

Nation’s Fastest Growing Electronics Manufacturing Marketplace Gears Up for Electronics Midwest

Industry News | 2010-07-09 18:16:23.0

With recent PCB book-to-bill reports showing positive signs of economic recovery in North America, the timing for building business in the electronics manufacturing industry seems ideal, especially in the Midwest. Helping companies take advantage of the favorable conditions and new industry trends, IPC — Association Connecting Electronics Industries® and Canon Communications have joined forces to produce Electronics Midwest, an exhibition and technical conference for the electronics assembly and printed board design and manufacturing industries.

Association Connecting Electronics Industries (IPC)

ASM Assembly Systems at the SMT Hybrid Packaging 2013 show

Industry News | 2013-03-12 13:42:20.0

With new SIPLACE placement machines and many software innovations, ASM Assembly Systems underscores how important the SMT Hybrid Packaging trade show in Nuremberg has become. At Booth 7-204, the SIPLACE team will present innovations from both ends of its platform spectrum: With the SIPLACE X3 S, it unveils the latest generation of the successful SIPLACE X high-end platform, while the SIPLACE D1i is a new solution for the more price-sensitive SMT production segment.

ASM Assembly Systems GmbH & Co. KG

Highlighting the Strength and Depth of Chinese Electronics Manufacturing

Industry News | 2011-04-20 21:38:55.0

Both local and international electronics manufacturers are aware of the fact that to miss a NEPCON China event is to forego numerous exciting business opportunities. NEPCON China is a trusted barometer of the state of the electronics manufacturing industry in China and Asia.

Reed Exhibitions - RX (Reed Exhibitions)

SIPLACE Very-High-Force Head features placement force of 70 N

Industry News | 2013-01-12 12:27:34.0

With its new SIPLACE Very-High-Force Head for odd-shaped components, ASM Assembly Systems is adding another major option for its SIPLACE SX placement machines. The new Very-High-Force Head is able to place components up to 30 millimeters high and 200 millimeters long with a force of up to 70 newtons. That way, users can process on their SMT line even extremely large components with snap-in or through-the-hole fasteners such as connector modules for automotive or IT applications.

ASM Assembly Systems GmbH & Co. KG

Great success for the SIPLACE team at Nepcon Shanghai 2013: SIPLACE X4i S wins three awards

Industry News | 2013-05-15 20:24:51.0

At this year's Nepcon Shanghai show the SIPLACE team received two highly influential awards for its new high-end SIPLACE X4i S platform: the EM Innovation Award China, the SMT China Vision Award and the SMT China Prime Product Award. For the fifth time running now, SIPLACE was able to win these prestigious awards, which are given out by independent panels.

ASM Assembly Systems GmbH & Co. KG

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