Industry News | 2004-06-24 17:35:13.0
New Lead-Free validation kit and service smoothes transition to "green" electronic assembly.
Industry News | 2007-10-04 17:14:39.0
Tempe, AZ - September 24, 2007 - FINETECH announces that it will demonstrate the Fineplacer� CRS 10 compact rework system in booth 210 at the upcoming SMTA International exhibition, scheduled to take place October 9-10, 2007 in Orlando, FL.
Industry News | 2007-10-23 16:19:57.0
Tempe, AZ - October 23, 2007 - FINETECH will demonstrate its fixed configuration, complete rework system, at the upcoming Nepcon East exhibition on October 30-31, 2007 at the Boston Convention Center.
Industry News | 2008-02-28 15:40:26.0
Tempe, AZ - January 2008 - FINETECH will display the Fineplacer� CRS 10 Compact Rework System in booth #577 at APEX 2008, scheduled for April 1-3, 2008 in Las Vegas.
Industry News | 2009-02-27 21:12:43.0
HOUSTON � February 2009 � BPM announces that it will feature the 3000FS Flash Memory Programmer in Hall 7 Booth # D-120 in distributor Esman's booth at the upcoming Electrotech 2009, scheduled to take place February 26-March 1, 2009 in Istanbul, Turkey.
Industry News | 2009-09-18 10:24:30.0
Tempe, AZ - FINETECH will exhibit the FINEPLACER® CRS 10 rework system in booth 322 at the upcoming SMTA International, scheduled for October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego, CA. The system will demostrate rework of 0201 passives, BGA‘s, and QFN devices, as well as residual solder removal.
Industry News | 2010-01-28 11:44:36.0
HOUSTON — January 21, 2010 — BPM Microsystems announces the retirement of Lyman Brown, executive vice president and chief operating officer, effective January 31, 2010. William White will transition back into the role of president and chief executive officer.
Industry News | 2012-05-30 13:50:20.0
Hesse & Knipps GmbH will discuss “Wedge Bonding for Chip-On-Board and Direct-Chip-Attach Applications” at the SMTA Philadelphia Chapter Meeting.
Industry News | 2017-11-09 14:55:51.0
BPM Microsystems is demonstrating its new 4900 automated programming system at Productronica. The 4900, with its advanced chip-scale part (CSP) device handling, on-the-fly vision alignment, and HS400 programming speeds, satisfies a vast range of programming needs in one automated system. Featuring high-performance laser marking and 3D inspection, the 4900 provides advanced serialization and quality control, meeting the highest programming and cyber security standards for automotive, aerospace, medical, industrial and mobile device industries.
Industry News | 2008-08-01 00:29:58.0
With the well-respected die attach brands of Hysol� and Ablestik�, Henkel has long been recognized for consistently pushing the bar higher when it comes to advanced semiconductor materials development. This pioneering philosophy has led to the development of yet another groundbreaking materials advance and the launch of Henkel's Ablestik 8000� Wafer Backside Coating� (WBC) technology.
