Industry News: two passes (Page 4 of 19)

Your Guest Invitation to Design & Manufacturing New England Courtesy of PNC Inc.

Industry News | 2017-04-17 11:59:44.0

This year, receive complimentary attendance courtesy of PNC Inc.

PNC Inc.

Process Fills Vias Faster than Squeegees

Industry News | 2003-03-11 09:04:04.0

Developed in response to customer requirements, the new Via Fill process from DEK delivers 100% fill of substrate vias with no voids and minimal surface residue.

ASM Assembly Systems (DEK)

Assel succeeds in ISO 14001 Re-certification

Industry News | 2011-12-20 04:06:18.0

The Polish EMS provider, based in Gdańsk, has successfully passed the ISO 14001 conformity evaluation by Lloyds

Assel

Engineered Material Systems Introduces a New Two-Component Epoxy Encapsulant (506-03A/B)

Industry News | 2018-01-28 20:07:34.0

Engineered Material Systems is pleased to debut its 506-03A/B, which is a two-component epoxy system with a convenient 1:1 volumetric mix ratio designed to pass rigorous reliability requirements.

Engineered Materials Systems, Inc.

Logic PD Kicks Off New Apprenticeship Program

Industry News | 2018-07-31 10:22:28.0

First class of apprentices begins training to enhance manufacturing skills.

Logic PD, Inc.

MANNCORP �HI OUTPUT� TURNKEY LINE TARGETS MID TO HIGH-VOLUME FLEXIBLE SMT ASSEMBLY

Industry News | 2008-07-19 12:18:17.0

An automated turnkey line now offered by Manncorp includes a 4-head pick and place that provides assets of speed, flexibility and fast changeover. The �Hi Output Line� also includes an inline fully automatic stencil printer, an 8-zone reflow oven and pass-through conveyor, priced below $180,000 complete. According to CEO Henry Mann, �The 10,500 cph placement speed allows mid-volume assemblers to step-up throughput while benefitting from the increased savings and service advantages of purchasing the entire line from a single-source provider.�

Manncorp

DEK’s DirEKt Ball Placement Technology Advances toward Microsphere Capability

Industry News | 2009-08-19 13:06:06.0

Extending its capabilities for placing solder spheres at high speed, DEK’s proven DirEKt Ball Placement™ process now enables accurate solder sphere deposition for spheres as small as 200µm in diameter with pitches as tight as 300µm. With the ability to achieve this accuracy and precision at a first pass yield of over 99.99%, DirEKt Ball Placement delivers the speeds necessary for modern package manufacture without sacrificing anything in the way of performance.

ASM Assembly Systems (DEK)

Signal Conditioners

Industry News | 2021-06-02 21:37:16.0

Signal conditioning is a process of data acquisition, and an instrument called a signal conditioner is used to perform this process. This instrument converts one type of electrical or mechanical signal (input-signal) into another (output-signal). The purpose is to amplify and convert this signal into an easy to read and compatible form for data acquisition or machine control. A signal conditioner helps to provide precise measurements, which are essential for accurate data acquisition and machine control. These instruments can perform an additional number of different functions.

Quick Time Engineering Inc

Intel and VJ Technologies to Present Pad Site Dress Methods at SMTAI 2010

Industry News | 2010-09-27 23:15:26.0

VJ Technologies, Inc., the leader in rework technologies and global provider of advanced X-ray inspection systems, announces that Intel’s James Wade and Raiyo Aspandiar, along with VJ Technologies’ Donald Naugler and Terry Leahy will present a paper titled “PCB Pad Site Dress Methods on BGA and Socket Pad Arrays” at the upcoming SMTA International, scheduled to take place October 24 - 28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.

VJ Electronix

Indium8.9HF1-P Delivers High First Pass Yields for In-circuit Testing

Industry News | 2013-12-10 12:14:34.0

Indium Corporation introduces a new Pb-free solder paste designed to combine best-in-class stencil printing performance, using Indium's unique halogen-free oxidation barrier technology with optimized no-clean residues for enhanced probe testing. Indium8.9HF1-P saves time and money on testing by eliminating false failures and giving the highest first pass yields.

Indium Corporation


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