Industry News: type 31 nozzle (Page 31 of 53)

KIC Introduces the new KIC Explorer Thermal Profiler at SMTAI

Industry News | 2007-10-04 14:47:31.0

San Diego � September 24, 2007 � KIC, the leader of thermal process development and control products and winner of multiple industry awards, announces that it will launch KIC Explorer, a new generation of thermal profiler in booth 608 at the upcoming SMTA International exhibition and conference, scheduled to take place October 7-11, 2007, in Orlando, FL.

KIC Thermal

Electronics Test Development gets faster with XJTAG Boundary Scan v3.6

Industry News | 2017-09-29 05:31:47.0

XJTAG, a world leading supplier of boundary scan technology has launched a major update to its flagship software, XJDeveloper. XJTAG v3.6 includes several new productivity and automation-focused enhancements, allowing engineers to setup tests for even the most complex boards in significantly less time.

XJTAG

Loadcell

Industry News | 2021-05-31 04:59:56.0

Weight is one of the essential parameters that need to be considered in many fields. The weight of the object needs to be weighted accurately to determine the content of the object. A load cell is commonly used in these situations where accuracy and precision of the weight of the object are important. The load cell is able to measure the weight of object with high accuracy.

Quick Time Engineering Inc

Essemtec’s Technology Day to Highlight Future Dispensing and MID Technologies

Industry News | 2012-11-06 11:22:15.0

Dispensing and MID (Molded Interconnected Devices) technologies are developing rapidly. Current technology drivers are LED and communication products. On September 28th, Essemtec’s technology day focused on new developments and future challenges. The event was free of charge for all participants.

ESSEMTEC AG

An interview with Erhard Hofmann, MD AdoptSMT

Industry News | 2016-04-01 23:53:56.0

Ahead of SMT Hybrid Packaging 2016 (26 to 28 April 2016), Erhard Hofmann, MD AdoptSMT explains what the company is showcasing in Nuremberg.

AdoptSMT Europe GmbH

Manncorp Brings High-Precision, Selective Soldering and Fluxing to the Bench-Top with the New ULTIMA Series

Industry News | 2012-10-09 16:18:14.0

The ULTIMA Series Selective Soldering and Fluxing Systems offer a new solution for soldering through-hole components and connectors to surface mount and mixed technology PCBs. Numerous engineering and design innovations have resulted in compact, bench-top systems loaded with features that deliver a level of performance that, until now, would have made selective soldering cost-prohibitive for many low- and medium-volume PCB assemblers.

Manncorp

Vitronics Soltec to Launch ZEVAm Selective Soldering Platform at Productronica 2015

Industry News | 2015-10-29 14:21:11.0

Vitronics Soltec will formally introduce their new ZEVAm Selective Soldering platform in Vitronics Soltec’s booth (Hall A4, Booth 554) at Productronica in Munich, Germany, November 10-12 2015. ZEVAm is a flexible, high-performing and affordable point-to-point soldering system offering a stunning array of process and productivity-enhancing features that bring value and flexibility to today’s selective soldering process.

Vitronics Soltec

Essemtec Announces Placement & Jetting in a Single Pass Through with the New FOX2

Industry News | 2017-01-11 17:03:45.0

Essemtec today announced plans to exhibit in Booth #1223 at the 2017 IPC APEX EXPO, scheduled to take place Feb. 14-16, 2017 at the San Diego Convention Center in Calif. Essemtec will debut the FOX² and demonstrate the compact Spider jet dispenser.

ESSEMTEC AG

Essemtec Wins the 2017 NPI Award for Multifunction Placement for the New FOX2

Industry News | 2017-02-21 15:59:49.0

Essemtec announces that it has been awarded a 2017 NPI Award in the category of Component Placement – Multifunction for its FOX2. The award was presented to the company during a Tuesday, Feb. 14, 2017 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO. This marks the 15th industry award that the Swiss manufacturer has received in recognition of its production systems for electronic assembly and packaging. The new FOX2 by Essemtec combines jetting of solder paste or glue and placement in a single machine. The new version is based on the original award-winning platform, which is the first machine in its class with linear motors and a mineral cast frame, providing excellent speed, stability, accuracy, and making it perfectly suited for use in small to medium production environments.

ESSEMTEC AG

IMAPS' Comprehensive Industry Guide Available Online

Industry News | 2001-03-19 11:32:31.0

The IMAPS Industry Guide, a comprehensive listing of products and services for over 600 organizations, is now available electronically and free of charge. The Guide provides a valuable resource and searchable database of not only IMAPS member companies but non-member companies as well. It is anticipated that by 2002 the Guide will feature over 1200 companies.

International Microelectronics Assembly and Packaging Society (IMAPS)


type 31 nozzle searches for Companies, Equipment, Machines, Suppliers & Information

Online Equipment Auction of Altronic: Small-Batch Surface Mount & Assembly Facility

High Precision Fluid Dispensers
Conductive Adhesive & Non-Conductive Adhesive Dispensing

High Throughput Reflow Oven
PCB Handling with CE

World's Best Reflow Oven Customizable for Unique Applications