Industry News | 2003-04-15 08:39:15.0
Granted supplier qualification by the United States Department of Defense's Defense Supply Center Columbus (DSCC)
Industry News | 2009-09-17 15:08:48.0
GREELEY, CO —FCT Assembly announces that it will debut four new solder pastes and showcase its breakthrough UltraSlic™ FG solder paste stencil in booth 417 at the upcoming SMTA International conference & exhibition, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego.
Industry News | 2014-05-06 10:43:05.0
Indium Corporation's Ed Briggs, senior technical support engineer, will present at the International Conference on Soldering and Reliability Wednesday, May 14 in Toronto, Canada.
Industry News | 2014-11-04 16:57:54.0
Indium Corporation's Ed Briggs, senior technical support engineer, will present at the SMTA Space Coast and Tampa Bay Expo & Tech Forum on Dec. 4 in Kissimmee, Fla.
Industry News | 2022-11-15 12:19:18.0
ZESTRON is pleased to announce that it will host a webinar titled "Jet Printing and Cleaning Challenges" on Tuesday, November 15th, from 11:00 AM to 12:00 PM EDT. This is the eleventh and final installment of the ZESTRON Academy 2022 Cleaning Webinar Series and will be presented by our industry expert, Kalyan Nukala, Application Engineer.
Industry News | 2003-02-21 08:45:28.0
The Costa Mesa facility has achieved the highest level of qualification for line width (2 mils) and spacing (3 mils) to date.
Industry News | 2009-05-01 01:10:48.0
ITASCA, IL � April 2009 � Kester announces that its FL250D no-clean solder paste has been added to the global approved materials list of a leading network equipment company due to its excellent properties in terms of eliminating/preventing head-in-pillow defects.
Industry News | 2009-05-18 17:19:51.0
GREELEY, CO - FCT Assembly debuts WS159 water-soluble solder paste, featuring FCT's latest technology in print and reflow of paste in the water soluble category.
Industry News | 2009-05-20 19:17:30.0
GREELEY, CO �FCT Assembly introduces WS177 lead-free water-soluble solder paste featuring its latest technology in print and reflow of paste in the water-soluble category for lead-free alloys.
Industry News | 2010-10-26 22:46:06.0
FCT Assembly introduces the new NC676 no-clean leaded solder paste, featuring its latest technology in print and reflow in the no-clean category.
