Industry News | 2024-03-01 16:23:48.0
The Branford Group ("Branford"), a leader in asset liquidation and valuation services, in partnership with Joseph Finn and New Mill Capital, will be hosting a major public auction event to sell assets from the complete facility closure of NexGen's East Syracuse, NY manufacturing facility. This multi-million-dollar investment will be available for bidding via online auction. Bidding will open on March 11th at 8:00am (ET) and will begin to close on March 13th at 11:00 am (ET).
Industry News | 2023-01-23 16:45:05.0
IPC announces the addition of Jeffrey Goldberg as director of North American government relations to its staff at IPC's offices in Washington, D.C. In this role, Goldberg will help lead IPC's federal advocacy work in collaboration with IPC's Government Relations Committee and IPC's Vice President of Global Government Relations Chris Mitchell. He will be charged with implementing an ambitious North American policy agenda at a time of increased interest among policymakers in the electronics supply chain.
Industry News | 2022-08-29 15:06:06.0
SMTA members and staff were among the 50 carefully-selected invitees who participated in the Future Electronics Workforce (F.E.W.) Summit held at Michigan Technological University (MTU) on August 17, 2022. Co-sponsored by Calumet Electronics and Michigan Technological University, and supported by the US Department of Defense (DoD) Industrial Base Analysis and Sustainment (IBAS) program, the summit had the goal of generating and implementing specific actions for each of the major stakeholder groups present that could ease the potentially crippling shortage of replacement technical staff in defense-critical electronics manufacturing.
Industry News | 2011-02-21 18:15:25.0
Count On Tools Inc., a leading provider of precision components and SMT spare parts, now offers an expanded selection of Juki SMT Tooling Nozzles, including the 500 and 800 series nozzles in both base designs (gold/silver). The nozzle designs enable highly accurate, repeatable and optimized chip placement.
Industry News | 2009-06-11 12:25:44.0
Company Expands Training Services
Industry News | 2003-02-07 08:40:55.0
The Industry's Most Invaluable Tool for Quality Assurance and Assembly Departments is Now Available in Japanese, German, Czech and Danish
Industry News | 2011-07-26 22:29:00.0
It’s well-known that residues on printed board assemblies can lead to serious reliability problems. To help the process engineering community deal with these difficulties, IPC has released the B revision of IPC-CH-65, Guidelines for Cleaning of Printed Boards & Assemblies.
Industry News | 2020-04-14 19:07:23.0
ITW EAE introduced the next-generation MPM® Momentum® II Printer with the release of the HiE and Elite models in November of 2019. Now the company is releasing the Momentum II BTB and Momentum II 100. The Momentum II BTB is a Back-to -Back configurable stencil printer that allows dual-lane processing for higher throughput without increasing either line length or capital investment.
Industry News | 2024-03-04 12:05:31.0
IPC praised today's issuance from the CHIPS for America R&D Office, through the National Institute of Standards and Technology (NIST), of a Notice of Funding Opportunity (NOFO) for research and development activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials.
Industry News | 2013-03-19 15:13:22.0
Dr. Choon Lee, senior vice president, Amkor Technology, and a leading expert and innovator in the field of packaging technology, will reveal their strengths and weaknesses during his keynote, “System Integration Challenges in Packaging,” at IPC Electronic System Technologies Conference & Exhibition (ESTC), on May 22, 2013.
