Industry News | 2010-09-13 15:36:15.0
IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.
Industry News | 2023-08-01 06:13:48.0
Industrial control applications play a vital role in modern manufacturing processes, ensuring precision, efficiency, and reliability in diverse industries. Two significant electronic assembly technologies, Surface Mount Technology (SMT) and Through-Hole Technology (THT), have long been used independently in the manufacturing sector. However, with the continuous evolution of technology, the integration of SMT and THT industries has emerged as a powerful trend, driving innovation, and offering new possibilities for industrial control applications. In this article, we will explore the synergies between SMT and THT, showcasing how their combination enhances industrial control solutions, making manufacturing processes smarter, faster, and more versatile.
Industry News | 2019-04-23 07:43:52.0
IPC announces the release of IPC-2591, Connected Factory Exchange (CFX). The electronics industry now has an industry standard available to all companies in the industry, regardless of size or location which can be used to quickly and easily implement “Industry 4.0” and “smart factory” applications to their manufacturing operations.
Industry News | 2011-09-19 18:12:59.0
In the realm of what you don’t know can hurt you, U.S. regulations on the import and export of sensitive electronics are constantly evolving. To help PCB manufacturers ensure compliance with International Traffic in Arms Regulations (ITAR) and Export Administration Regulations (EAR), IPC will hold a comprehensive workshop, ITAR/EAR Compliance for PCB Manufacturers - Complying with U.S. Export Controls, December 6–7, 2011, in Washington, D.C.
Industry News | 2016-06-15 20:20:37.0
The first ever Rework Experience Competition was held at this year’s SMT Hybrid Packaging international exhibition and conference. This competition tested competitor’s skills in reworking a finished printed circuit board. There were seven total competitors and all seven successfully completed the challenge. Ljupce Talevski, from Aluwave AB took first place. In second place was Ekatarina Stahlmann from Grundig Business Syst. Coming in third place was Conny Hielscher from Grundig Business Syst.
Industry News | 2021-03-15 15:36:54.0
Latest version sets minimum messaging requirements for equipment listing on IPC-CFX-2591 Qualified Products List (QPL)
Industry News | 2012-09-10 12:48:23.0
To help companies gain the most out of HDI technology, Raytheon is sponsoring the “IPC HDI Conference: Advancements in Materials, Processes and Applications,” October 24–25 in Los Angeles, Calif.
Industry News | 2013-09-30 16:09:37.0
The inaugural IPC APEX India™ conference and exhibition was held 26–29 August at the NIMHANS Convention Centre in Bangalore, India.
Industry News | 2022-11-21 15:50:26.0
ITW EAE is releasing a new feature for the Electrovert Wave Soldering machines that provides automatic adjustment of the laminar wave flow to match the board velocity. To fully optimize the flow dynamics of the laminar wave, the velocity of the PCB needs to equal the flow of the solder over the weir of the exit wing. When the wave flow is fully optimized, the PCB 'peels' away from the solder which minimizes the opportunity for bridging defects to occur.
Industry News | 2020-04-14 18:49:39.0
EAE, the Electronic Assembly Equipment division of ITW is the proud recipient of an IPC APEX 2020 New Product Innovation (NPI) Award. The award recognizes the Electrovert DwellFlex 4.0 wave solder nozzle.
