Industry News: typical lead free solder pot temperature (Page 14 of 99)

Wavelength Electronics Purchases Hentec/RPS Vector 460 Selective Soldering System

Industry News | 2021-06-28 12:37:41.0

Vector 460 offers unmatched thermal capability, rapid programming, and simplistic elegance in operation.

Hentec Industries, Inc. (RPS Automation)

ECOSELECT1 - The Perfect Start-up Solution for Efficient Selective Soldering

Industry News | 2011-12-01 14:01:34.0

Ersa has expanded its product range by the ECOSELECT 1: a selective soldering machine requiring less than 3 m² of space - thus fitting optimally into cell production environments.

kurtz ersa Corporation

Visit SHENMAO at the SMTA Long Island Conference & Exhibition

Industry News | 2019-10-08 06:05:58.0

SHENMAO America, Inc. is pleased to announce that it will exhibit at the SMTA Long Island Expo & Tech Forum, scheduled to take place Thursday, October 17, 2019 at the Melville Marriott in Melville, NY. The company will showcase its PF735-PQ10 low temperature solder (LTS) and SM-862 Liquid Flux.

Shenmao Technology Inc.

Inovar Increases Throughput and Flexibility with Selective Solder from Ersa

Industry News | 2015-03-30 18:16:10.0

Kurtz Ersa North America announces that Inovar has purchased a VERSAFLOW 3/45 selective soldering system with dual solder pots. Inovar is a leading contract manufacturer in the Intermountain West located in Logan, Utah. The VERSAFLOW 3/45 will allow Inovar to run two alloys (tin-lead and lead-free) in one machine on-the-fly.

kurtz ersa Corporation

High Reliability & High Temperature Application Solution – Solder Joint Encapsulant Paste

Industry News | 2017-08-08 09:40:33.0

(Albany, NY) August 8, 2017 – Dr. Wusheng Yin, YINCAE Advanced Materials LLC, will be discussing a new technology – solder joint encapsulant paste for high temperature applications, at the 2017 SMTA International Conference in Rosemont, IL, as a potential solution to the current limitations and challenges presented by miniaturization. As miniaturization continues to be the driving force, the industry is beginning to face challenges associated with this trend including: warpage and reliability issues.

YINCAE Advanced Materials, LLC.

High Reliability & High Temperature Application Solution – Solder Joint Encapsulant Paste

Industry News | 2017-08-08 09:40:36.0

(Albany, NY) August 8, 2017 – Dr. Wusheng Yin, YINCAE Advanced Materials LLC, will be discussing a new technology – solder joint encapsulant paste for high temperature applications, at the 2017 SMTA International Conference in Rosemont, IL, as a potential solution to the current limitations and challenges presented by miniaturization. As miniaturization continues to be the driving force, the industry is beginning to face challenges associated with this trend including: warpage and reliability issues.

YINCAE Advanced Materials, LLC.

Nihon Superior USA Exhibits SN100C at IPC International Conference on Flexible Circuits 2008

Industry News | 2008-02-15 15:45:43.0

OSAKA, JAPAN � February 13, 2008 � Nihon Superior USA, a subsidiary of Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that it showcased its SN100C products with FCT Assembly, one of its US SN100C Global Partners, at the IPC International Conference on Flexible Circuits, that took place February 13, 2008 in Phoenix, Ariz.

Nihon Superior Co., Ltd.

Don't Miss the Leader in Solder Recovery – EVS in Booth 1100 at APEX

Industry News | 2022-12-14 12:27:18.0

EVS International is pleased to announce plans to exhibit at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. The EVS team will showcase the latest innovation in solder recovery in Booth #1100 – the EVS 11KLFHS.

EVS International

SHENMAO Debuts Low-Temp Joint Enhanced Solder Paste PF735-EP307

Industry News | 2022-11-15 12:33:16.0

SHENMAO America, Inc is pleased to introduce its newest offering: PF735-EP307 Joint Enhanced Solder Paste (JEP). The new low melting point epoxy-based solder material has been developed for extremely fine-pitch or fine pad soldering, especially advanced display assembly.

Shenmao Technology Inc.

Techcon Systems to Display Full Line of Valves at Productronica 2015

Industry News | 2015-10-21 19:35:48.0

Techcon Systems today announced they will exhibit a full line of valves and robots in Hall A4, Booth 221 at the upcoming Productronica International Trade Fair, scheduled to take place November 10-13, 2015 at the Messe in Munich, Germany.

Techcon Systems


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