Industry News | 2017-10-05 05:56:21.0
The SMTA Capital Chapter is pleased to announce its third meeting of 2017 on November 7th, scheduled from 5:30 pm to 8:00 pm at ZESTRON Americas, 11285 Assett Loop, Manassas, VA, 20109. Ravi Parthasarathy, Senior Application Engineer, ZESTRON Americas, will present “Cleaning Before Conformal Coating” and “pH Neutral Cleaning Agents - Market Expectation and Field Performance”.
Industry News | 2012-02-07 00:45:44.0
IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.
Industry News | 2011-02-19 18:32:03.0
From a record number of technical abstract submissions, the best papers in PCB and electronics manufacturing and assembly were selected for presentation at the IPC APEX EXPO™ Technical Conference, April 12–14, 2011 in Las Vegas. Featuring new research and innovations from industry experts around the world, the IPC APEX EXPO Technical Conference will cover more than 30 technical topics to provide the industry with practical solutions and new opportunities for the future.
Industry News | 2010-03-27 19:35:44.0
BANNOCKBURN, Ill., USA, - IPC — Association Connecting Electronics Industries® announced today the February findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.
Industry News | 2013-07-17 19:05:42.0
IPC — Association Connecting Electronics Industries® will host IPC APEX India™ on 26–29 August 2013 at the NIMHANS Convention Centre in Bangalore, India.
Industry News | 2013-07-19 11:33:18.0
IPC — Association Connecting Electronics Industries® will host IPC APEX India™ on 26–29 August 2013 at the NIMHANS Convention Centre in Bangalore, India.
Industry News | 2022-01-14 17:06:40.0
Expanded technical conference award categories include NextGen and Student Research
Industry News | 2012-08-03 04:12:21.0
Glichn wave solder machine with bench-top and lead free model LF230A is one of new breakthrough products in August of 2012. Titanium alloy material is applied in the lead free solder pot, soldering capacity is 85kg; Standard design is foam system in the desk wave soldering machine. “But we get many customers’ requirement that spray system on the wave solder machine, so Glichn technical department design another spray fluxer system on the bench-top lead free soldering machine. It is technology break for us.” One of engineers said.
Industry News | 2018-10-18 09:25:57.0
about wave soldering machine tin pot
Industry News | 2018-10-18 08:42:00.0
Reflow oven zone temperature set up and thermal profile
