Industry News: uic gsm flip chip (Page 1 of 1)

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

Count On Tools Introduces Universal Instruments’ GSM Special Low Force Nozzle with Replaceable Tips for Delicate Components

Industry News | 2010-05-20 12:47:37.0

GAINESVILLE, GA ― Count On Tools Inc., a leading provider of precision components and SMT spare parts, introduces Universal Instruments’ GSM special low force (spring suspended) nozzle with replaceable tips for delicate components. Count On Tools’ new low force nozzles are ideal for gaas die, gallium arsenide, thin silicone (less than 0.10" in thickness), die with air bridges and flip chips.

Count On Tools, Inc.

Dispenser Bound for Chinese Technology Centre

Industry News | 2003-05-29 08:13:34.0

Universal Instruments and Asymtek have formed a partnership that will place an Asymtek Millennium 2020 dispenser in Universal's new Technology Excellence Centre in Suzhou, China.

Universal Instruments Corporation

Universal Moves to Meet Customers' Need for Fully Integrated Assembly Solutions

Industry News | 2001-01-29 14:52:11.0

Universal Instruments is taking a new approach to the sale and service of fully integrated assembly solutions. The company is forging a closer relationship with its sister companies in the Dover Technologies unit of Dover Corporation - DEK and Vitronics Soltec - to offer complete solutions that contract manufacturing customers are now demanding. These solutions are just one more way that Universal is empowering its customers' business.

Universal Instruments Corporation

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