Industry News | 2022-09-14 07:03:00.0
Austin American Technology (AAT) is pleased to announce that it will exhibit with SMarTsol Technologies at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Sept. 21-22, 2022, at the Expo Guadalajara in Jalisco, Mexico. SMarTsol, the #1 team in Mexico, will showcase AAT's in-line cleaners, including the HydroJet® In-line cleaning system – the preferred cleaner for large electric vehicle manufacturers.
Industry News | 2021-02-12 16:00:16.0
Seika Machinery, Inc. is pleased to announce its participation in the 2021 IPC APEX Virtual EXPO, scheduled to take place March 9-11, 2021 online at www.ipcapexexpo.org. Seika will highlight the Sawa SC-BM500E Automatic Ultrasonic Metal Stencil Cleaner, Sayaka SAM-CT34NJW Twin Table PCB Router with online camera for programming, Tsuchiyama n=1 Checker FAI and Kyowa PCAS Software Series for PCB Measurement.
Industry News | 2016-02-24 15:57:12.0
Introduced to the electronics market in 2014, NanoSlic is a proprietary thermoset polymer coating that renders metals, glass and polymers hydrophobic and oleophobic for improved protection and performance. FCT has developed not only the breakthrough chemistry, but also the equipment and application process that provide a turnkey stencil coating solution, NanoSlic Gold. Though used in multiple markets (www.nanoslic.com) for various safeguarding purposes, for electronics assembly applications, NanoSlic-coated stencils dramatically improve printing performance.
Industry News | 2010-06-11 13:38:26.0
TORRANCE, CA — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that, according to various studies, the implementation of its Sawa Eco-Roll SC-ER360 wiper roll cleaner provides a 50 percent reduction in costs.
Industry News | 2011-09-21 14:09:34.0
Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will highlight its new advanced machinery in Booth #136 at the upcoming SMTA International Conference & Exhibition
Industry News | 2009-07-02 17:51:04.0
Recognising that too many print processes are compromised by poor quality Consumables, DEK’s Process Improvement Products are designed to boost productivity and yield, reduce the risk of defects and minimise rework.
Industry News | 2009-07-07 13:32:54.0
Recognising that too many print processes are compromised by poor quality Consumables, DEK’s Process Improvement Products are designed to boost productivity and yield, reduce the risk of defects and minimise rework.
Industry News | 2018-05-09 20:32:24.0
KYZEN announced that it will reveal the latest research findings from controlled laboratory tests conducted in the interest of improving stencil printing reliability at SMT Hybrid Packaging 2018. The research indicates consistently lower production yields are delivered when some of the industry’s most common cleaning agents are utilized in under-stencil wipe applications. Demonstrated improvements for a multitude of standard processes, solder pastes and laboratory conditions are being made available to help industry experts. Key findings and related video proofs also will be shared in Hall 4A, Stand 536, June 5-7, 2018 at the Messe in Nuremberg, Germany. The introduction video can be viewed here: www.KYZEN-SneakPeek.com
Industry News | 2010-11-06 17:45:03.0
Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will highlight its latest environmentally responsible cleaning solutions at the upcoming High Performance Cleaning and Coating Conference, scheduled to take place November 16-18, 2010 at the Renaissance Hotel & Convention Center in Schaumburg, IL.
Industry News | 2016-02-16 11:39:48.0
KYZEN announced that it will reveal the latest research findings from controlled laboratory tests conducted in the interest of improving stencil printing reliability at the 2016 IPC APEX EXPO. The research indicates consistently lower production yields are delivered when some of the industry’s most common cleaning agents are utilized in under-stencil wipe applications. Demonstrated improvements for a multitude of standard processes, solder pastes and laboratory conditions are being made available to help industry experts. Key findings and related video proofs also will be shared in Booth #1869, March 15-17, 2016 at the Las Vegas Convention Center.
