Industry News: underfil (Page 11 of 41)

Press Release: YINCAE’S New Reflowable Underfill Material: SMT 160

Industry News | 2018-01-16 10:40:31.0

Press Release: YINCAE’S New Reflowable Underfill Material: SMT 160

YINCAE Advanced Materials, LLC.

Zymet Announces Highly Crack Resistant Underfill for Thin, Flexible Assemblies, CN-1751-4

Industry News | 2013-02-08 23:26:44.0

Zymet has introduced a new reworkable underfill encapsulant, CN-1751-4, that is extraordinarily crack resistant, to withstand flexing experienced by flexible printed circuitry or drops and shocks of very thin printed circuit assemblies.

Zymet, Inc

AI Technology (AIT) Introduces Novel High Temperature Large Area Underfill with Proven Stress Absorption

Industry News | 2014-07-28 13:56:52.0

240°C and novel stress absorbing capabilities to allow long-term reliability of large area flip-chip devices.

AI Technology, Inc. (AIT)

SMT 88UL Super-Fast Flow Room Temperature Underfill

Industry News | 2017-06-06 10:38:43.0

YINCAE has developed a new innovative, room temperature flow, capillary underfill: SMT 88UL. SMT 88UL is a super-fast flow capillary underfill designed to flow into gaps as small as 10µm at room temperature without pre-heating a substrate.

YINCAE Advanced Materials, LLC.

SMT 158UL Highly Filled Room Temperature Underfill

Industry News | 2017-06-13 09:00:37.0

YINCAE has developed a new, innovative, highly filled, room temperature flow, capillary underfill: SMT 158UL. SMT 158UL is a highly filled capillary underfill designed to flow into gaps as small as 10µm at room temperature without pre-heating a substrate.

YINCAE Advanced Materials, LLC.

Press Release: Low Temperature Reflowable Underfill Material: SMT 160L

Industry News | 2018-01-16 10:34:16.0

Press Release: Low Temperature Reflowable Underfill Material: SMT 160L

YINCAE Advanced Materials, LLC.

Indium Corporation�s NF260 Wins Third Prestigious Award

Industry News | 2006-04-17 11:14:44.0

Indium Corporation�s NF260 No-Flow Underfill was awarded the 2006 EM Asia

Indium Corporation

SMT 88UH Fast Cure, Reworkable Underfill

Industry News | 2014-07-08 11:04:03.0

YINCAE Advanced Materials, LLC is pleased to announce the availability of the SMT 88UH. SMT 88UH is a new and groundbreaking underfill. It can be underfilled at room temperature without preheating a substrate.

YINCAE Advanced Materials, LLC.

World’s Best Flip Chip Underfill: SMT 158 Series

Industry News | 2014-08-12 16:03:12.0

(Albany, NY) August 12, 2014. YINCAE Advanced Materials, LLC is pleased to announce the availability of a series of new underfill products that enables fast flowing, excellent reliability, and use on several different applications. This combination of characteristics enables SMT 158 series to be the world’s best flip chip underfill.

YINCAE Advanced Materials, LLC.

YINCAE's Fully Flux Residue Compatible Underfill: UF 158HA

Industry News | 2022-08-16 16:11:50.0

YINCAE is excited to announce that we have developed UF 158HA that is fully compatible with flux residue and high performance underfill. Using UF 158HA can eliminate cleaning process and pollution from the cleaning process, and simplify the manufacturing process.

YINCAE Advanced Materials, LLC.


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