Industry News: underfil (Page 16 of 41)

YINCAE Advanced Materials Wins Global Technology Award at SMTAI 2022 for Adhesives/Underfills/Encapsulants

Industry News | 2022-11-08 14:43:06.0

YINCAE Advanced Materials, LLC is proud to announce that our company was awarded the 2022 Global Technology Award in the Adhesives, Underfills, and Encapsulants category! This ceremony took place on Wednesday, November 2nd at SMTAI 2022 Exhibition in Minneapolis, USA.

YINCAE Advanced Materials, LLC.

Henkel's Materials Innovations Honored at APEX

Industry News | 2008-04-10 21:33:27.0

Market-leading electronic materials company, Henkel Corporation, continues to prove its commitment to developing inventive and process-enhancing materials technologies and last week this effort was recognized as the company received three prestigious awards during the APEX event in Las Vegas.

Henkel Electronic Materials

FINEPLACER� Application Packages for Advanced Rework � PoP/Underfill/01005/Single Ball

Industry News | 2007-11-27 12:01:32.0

FINETECH application packages offered for FINEPLACER� rework systems provide an easy way to enhance the machine�s scope of application. These packages include custom-tailored modules and tools to ensure perfect results for special rework applications.

Finetech

75th Order Affirms Value of MVP's Semiconductor Micro-electronics and Packaging Inspection Systems

Industry News | 2008-07-14 14:42:19.0

Carlsbad, CA (July 14, 2008) -- Machine Vision Products, Inc. A worldwide leader in Automated Optical inspection for the Micro-electronics, Semiconductor and SMT manufacturing industries today announced that it has received its 75th system order for its recently-introduced Ultra 850G Packaging and Micro-electronics Automated Optical Inspection (Micro-electronics AOI) platform. These orders reflect the success of this product in providing unique defect coverage and metrology in the Flux, Paste, Die Placement, Component and Underfill processes.

Machine Vision Products, Inc

New Low Residue No-Clean Flip Chip Flux SMF-D61 from SHENMAO

Industry News | 2024-02-12 13:43:22.0

SHENMAO Technology is pleased to announce the availability of its latest innovation, the SMF-D61 Low Residue No-Clean Flip Chip Flux. This advanced flux is meticulously engineered to meet the demanding requirements of flip chip dipping applications, offering exceptional performance and reliability throughout the soldering process.

Shenmao Technology Inc.

Essemtec is exhibiting at SMTconnect booth 4.209.

Industry News | 2024-06-10 10:12:04.0

We invite you to SMTconnect, Booth 4.209, from June 11 - 13 in Nuremberg, Germany. Discover Essemtec's solutions with all-in-one combined dispensing & pick-and-place processes and integrated inspection systems.

ESSEMTEC AG

Indium Corporation Announces New Position

Industry News | 2007-04-30 23:35:44.0

Indium Corporation announced that Anne McKerrow has been appointed to the newly created position of Best Practice Manager.

Indium Corporation

DEK Galaxy Platform Enables LORD Corporation’s Product Development Initiatives

Industry News | 2009-08-20 15:26:58.0

To progress development of its next-generation pre-applied underfill materials, LORD Corporation has selected DEK’s award-winning Galaxy platform. LORD, a Cary, North Carolina-based leading manufacturer of electronic materials, found the precision, accuracy and process capability of the Galaxy simply unmatched and, therefore, the ideal system to enable its materials innovation initiatives.

ASM Assembly Systems (DEK)

Henkel develops materials innovations for high power electronics

Industry News | 2012-04-27 19:07:14.0

Advances in power electronics are key to a sustainable energy future: Semiconductor power devices such as insulated gate bipolar transistors (IGBTs) deliver the high switching speeds which are critical for energy efficiency in electric cars, trains and other industrial applications. For the use of alternative energies, ultra-high efficiency and high-power density designs are imperative. Recognizing these market needs, Henkel has developed a comprehensive range of materials to further advance power electronics technology and will showcase these innovations from 8 to 10 May at SMT in Nuremberg.

Henkel Electronic Materials

Indium Corporation Honored with Two Global Technology Awards at Productronica

Industry News | 2023-11-20 15:34:41.0

Indium Corporation was honored with two prestigious GLOBAL Technology Awards during an awards ceremony on November 14 at Productronica in Munich, Germany. The company was honored in both the Flux and Adhesives/Underfills Encapsulants categories for NC-809, a halogen-free, ultra-low residue flip-chip flux, and InTACK™, a drop-in, robust tacking agent for power module assembly, respectively. Presented by Global SMT & Packaging, the Global Technology Awards recognize the best new innovations in the printed circuit assembly and packaging industries introduced in the past 12 months.

Indium Corporation


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